As the automotive industry transitions to software-defined vehicles and new E/E architectures, the demand for high-performance hardware and robust cybersecurity solutions increases.
Triad's new facility located in the Sterling Building at 353 North Fourth Avenue, marked a significant milestone in the company's continuous growth and cutting-edge innovation in analog and mixed-signal engineering.
Vishay Intertechnology has introduced a new Automotive Grade IHDF edge-wound, through-hole inductor with rated current up to 72 A and saturation currents up to 230 A.
Collaboration on TSMC’s COUPE silicon photonics platform dramatically speeds chip-to-chip and machine-to-machine communication for cloud, datacenters, HPC, and AI chips.
Innodisk announces the launch of its industry’s first MIPI over Type-C solution. This exclusive technology overcomes traditional MIPI cable length limitations, allowing embedded camera modules to be positioned farther from the system.
CEA-Leti has been chosen to coordinate two projects to help build first-class 6G technology capabilities and boost standardization efforts across Europe.