Samsung unveiled the expansion of its CXL memory module portfolio and showcased its latest HBM3E technology, reinforcing leadership in high-performance and high-capacity solutions for AI applications.
Sivers Semiconductors announces that its subsidiary, Sivers Photonics, in collaboration with ecosystem partners,is demonstrating its advanced laser chip and array technology at the Optical Fiber Communication (OFC) Conference in San Diego on March 24-28, 2024.
Melexis unveils the ADK81116 application development kit. Designed to simplify the development of dynamic RGB-LED automotive applications, this comprehensive solution comes with pre-loaded configurable firmware.
IAR has announce enhancements to its premier development environment to support the first general-purpose 32-bit RISC-V MCUs with Renesas’ internally developed CPU core.
Featuring a Common Cathode Configuration, Devices Can Withstand IOL Cycles Up to 5x That of the Previous TO-244 Generation for Improved Life Expectancy While Reducing Losses.