Designed for USB Hi-Speed peripherals, the new controller adds security hardware, DMA support, and large on-chip buffering for data-intensive devices.

A new single-chip connectivity platform targets low-power IoT deployments by combining 20 MHz Wi-Fi 7, multi-protocol support, and robust operation in congested wireless environments.

New 750 V G2 devices in Q-DPAK and D2PAK packages improve thermal behavior, switching efficiency, and gate-drive flexibility for automotive chargers and industrial power systems.

Infineon enables 3M to achieve reliable 10Gbps data transmission over extended passive cable lengths for industrial machine vision systems.

Infineon gains a preliminary ITC ruling confirming GaN patent validity and Innoscience’s infringement ahead of the April 2026 U.S. decision.

Infineon’s XDP hybrid-flyback controller and CoolGaN devices power Anker’s compact 160 W charger with enhanced efficiency, power density and system performance.

CoolGaN bi-directional switch enables single-stage power conversion, boosting energy output, reliability, and compactness while cutting power loss by up to 68%.

The new TLE994x and TLE995x SoCs integrate control, diagnostics, and security in one chip, supporting efficient, compact, and safe brushed and brushless motor applications.

Infineon's UWB lab in Graz with Silicon Austria Labs features motion-capture systems and centimeter-level precision for automotive, IoT, and industrial localization applications.

The new IPOSIM feature enables realistic modeling of switching behavior, thermal dynamics, and gate driver effects, helping engineers optimize EV, solar, and industrial power designs efficiently.