28 {{ "2026-10-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-28T00:00:00+00:00" | date "longDate" }}

Microchip News

Radiation-Hardened Multicore RISC-V Processors for Spaceflight Computing

Microchip validated radiation tolerance and initial silicon benchmarks for the PIC64-HPSC architecture to expand onboard autonomous spacecraft processing.

Read more…

28 {{ "2026-10-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-28T00:00:00+00:00" | date "longDate" }}

Anduril News

Anduril and Qualcomm to Rebuild American Computer Manufacturing

Beginning with a U.S.-built laptop powered by the Snapdragon X Series platform, BlueChip will establish the manufacturing capabilities and supplier base needed to bring computer production back to America.

Read more…

28 {{ "2026-10-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-28T00:00:00+00:00" | date "longDate" }}

Parker News

Parker Chomerics launches reusable thermal gap filler pad

The THERM-A-GAP PAD 30RB delivers 3.0 W/m-K conductivity with excellent rebound for multiple assembly cycles.

Read more…

28 {{ "2026-10-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-28T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMicroelectronics Unveils Compact Intelligent Power Modules for Appliances

The SLLIMM series shrinks 600V 3-phase IGBT inverters by 30% for space-constrained motor drives and heat pumps.

Read more…

26 {{ "2026-10-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-26T00:00:00+00:00" | date "longDate" }}

TDK News

High Voltage NTC Temperature Sensors for Power Electronics

TDK Corporation expands its NTC temperature sensor portfolio with M704 and M705 probe assemblies, resolving high-voltage insulation and precise thermal monitoring challenges.

Read more…

23 {{ "2026-10-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-23T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Power System-in-Package GaN Half-Bridge Integration

STMicroelectronics MasterGaN7 integrates 650V half-bridge transistors and stabilized drivers to boost efficiency, frequency, and power density across compact industrial and consumer converters.

Read more…

22 {{ "2026-10-22T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-22T00:00:00+00:00" | date "longDate" }}

Ryder Industries News

Off-the-Shelf Electronic Modules for Embedded Design

Ryder Industries introduces pre-validated radio frequency, audio amplification, and power supply subassemblies to mitigate component shortages and accelerate electromagnetic compatibility testing.

Read more…

22 {{ "2026-10-22T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-22T00:00:00+00:00" | date "longDate" }}

Allegro Micro Systems News

48V Power Integration and Precision Sensors for Humanoid Robots

Allegro MicroSystems introduces a compact power management and spatial tracking portfolio designed to resolve thermal and spatial constraints in autonomous robotic manipulators.

Read more…

22 {{ "2026-10-22T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-22T00:00:00+00:00" | date "longDate" }}

innodisk

Innodisk Launches GMSL2 Camera Starter Kit for Edge AI Vision

Four 3MP cameras, capture hardware, and NVIDIA Jetson Orin Nano source code simplify multi-camera integration for automotive ADAS and robotics applications.

Read more…

22 {{ "2026-10-22T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-22T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

UL Validates Keysight Automated Anti-Islanding Grid Testing

Independent UL Solutions study verifies that Keysight automated PHIL testing matches traditional RLC load-bank methods while cutting execution time to under one day.

Read more…

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Radiation-Hardened Multicore RISC-V Processors for Spaceflight Computing

Microchip validated radiation tolerance and initial silicon benchmarks for the PIC64-HPSC architecture to expand onboard autonomous spacecraft processing.

Anduril and Qualcomm to Rebuild American Computer Manufacturing

Beginning with a U.S.-built laptop powered by the Snapdragon X Series platform, BlueChip will establish the manufacturing capabilities and supplier base needed to bring computer production back to America.

Parker Chomerics launches reusable thermal gap filler pad

The THERM-A-GAP PAD 30RB delivers 3.0 W/m-K conductivity with excellent rebound for multiple assembly cycles.

STMicroelectronics Unveils Compact Intelligent Power Modules for Appliances

The SLLIMM series shrinks 600V 3-phase IGBT inverters by 30% for space-constrained motor drives and heat pumps.

High Voltage NTC Temperature Sensors for Power Electronics

TDK Corporation expands its NTC temperature sensor portfolio with M704 and M705 probe assemblies, resolving high-voltage insulation and precise thermal monitoring challenges.

Power System-in-Package GaN Half-Bridge Integration

STMicroelectronics MasterGaN7 integrates 650V half-bridge transistors and stabilized drivers to boost efficiency, frequency, and power density across compact industrial and consumer converters.

Off-the-Shelf Electronic Modules for Embedded Design

Ryder Industries introduces pre-validated radio frequency, audio amplification, and power supply subassemblies to mitigate component shortages and accelerate electromagnetic compatibility testing.

48V Power Integration and Precision Sensors for Humanoid Robots

Allegro MicroSystems introduces a compact power management and spatial tracking portfolio designed to resolve thermal and spatial constraints in autonomous robotic manipulators.

Innodisk Launches GMSL2 Camera Starter Kit for Edge AI Vision

Four 3MP cameras, capture hardware, and NVIDIA Jetson Orin Nano source code simplify multi-camera integration for automotive ADAS and robotics applications.

UL Validates Keysight Automated Anti-Islanding Grid Testing

Independent UL Solutions study verifies that Keysight automated PHIL testing matches traditional RLC load-bank methods while cutting execution time to under one day.

International