11 {{ "2026-08-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-11T00:00:00+00:00" | date "longDate" }}

Nordic Semiconductor News

Satellite and Cellular Connectivity Certification for Digital Infrastructure

Nordic Semiconductor and LooUQ obtain satellite network certification for embedded modems to accelerate dual-mode cellular and satellite IoT deployment across remote industrial infrastructure.

Read more…

11 {{ "2026-08-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-11T00:00:00+00:00" | date "longDate" }}

MURATA News

Murata Heads to Hot Chips 2026

At Hot Chips 2026, taking place August 23-25 in Palo Alto, California, Murata will showcase the technologies powering AI at the last millimeter.

Read more…

10 {{ "2026-08-10T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-10T00:00:00+00:00" | date "longDate" }}

Samsung News

Next-Generation 3D Memory Architectures for AI Data Infrastructure

Samsung Electronics unveils advanced 3D memory technologies, focusing on stacking architectures to optimize bandwidth and capacity for artificial intelligence systems.

Read more…

07 {{ "2026-08-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-07T00:00:00+00:00" | date "longDate" }}

Molex News

Compact Hybrid Connectors Simplify Humanoid Robot Joint Wiring

Molex combines 15 A power delivery and 1 Gbps Ethernet in a 5.65 mm routing profile for humanoid robots, AMRs and industrial automation systems.

Read more…

07 {{ "2026-08-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-07T00:00:00+00:00" | date "longDate" }}

Pickering News

High-Current LXI Switching Systems for Automated Power Testing

Pickering Interfaces introduces a standardized hardware architecture designed to route high-voltage signals and manage power supplies within the automotive data ecosystem.

Read more…

07 {{ "2026-08-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-07T00:00:00+00:00" | date "longDate" }}

Power Integrations News

2200 V Gallium Nitride Scales High-Voltage Power Systems

Power Integrations introduces a high-voltage semiconductor solution designed to support advanced power conversion demands in data centers and renewable infrastructure.

Read more…

06 {{ "2026-08-06T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-06T00:00:00+00:00" | date "longDate" }}

Samsung News

Next-Generation Vertically Stacked Memory Architectures For Artificial Intelligence Infrastructure

Samsung Electronics introduces advanced hybrid bonding technologies and ultra-high-layer storage components to maximize bandwidth efficiency in parallel computing systems.

Read more…

06 {{ "2026-08-06T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-06T00:00:00+00:00" | date "longDate" }}

Ambiq News

Open-Source Profiler for Edge AI Workloads

Ambiq Micro has released a diagnostic utility designed to provide cycle-level execution metrics for neural network optimization on resource-constrained microcontrollers.

Read more…

06 {{ "2026-08-06T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-06T00:00:00+00:00" | date "longDate" }}

AMD News

AMD, Supermicro and Spectro Cloud Launch Turnkey Solution

Built on AMD EPYC processors, AMD Instinct GPUs and AMD Pensando networking, the solution is integrated into select Supermicro systems and orchestrated by Spectro Cloud.

Read more…

05 {{ "2026-08-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-05T00:00:00+00:00" | date "longDate" }}

NXP News

Ultra-Wideband Supports Digital Access and Vehicle Presence Detection

BMW Group is deploying NXP Semiconductors’ ultra-wideband technology for secure digital vehicle access and in-cabin presence detection across selected 2026 vehicle programs.

Read more…

Case studies

Interactive Installations

Satellite and Cellular Connectivity Certification for Digital Infrastructure

Nordic Semiconductor and LooUQ obtain satellite network certification for embedded modems to accelerate dual-mode cellular and satellite IoT deployment across remote industrial infrastructure.

Murata Heads to Hot Chips 2026

At Hot Chips 2026, taking place August 23-25 in Palo Alto, California, Murata will showcase the technologies powering AI at the last millimeter.

Next-Generation 3D Memory Architectures for AI Data Infrastructure

Samsung Electronics unveils advanced 3D memory technologies, focusing on stacking architectures to optimize bandwidth and capacity for artificial intelligence systems.

Compact Hybrid Connectors Simplify Humanoid Robot Joint Wiring

Molex combines 15 A power delivery and 1 Gbps Ethernet in a 5.65 mm routing profile for humanoid robots, AMRs and industrial automation systems.

High-Current LXI Switching Systems for Automated Power Testing

Pickering Interfaces introduces a standardized hardware architecture designed to route high-voltage signals and manage power supplies within the automotive data ecosystem.

2200 V Gallium Nitride Scales High-Voltage Power Systems

Power Integrations introduces a high-voltage semiconductor solution designed to support advanced power conversion demands in data centers and renewable infrastructure.

Next-Generation Vertically Stacked Memory Architectures For Artificial Intelligence Infrastructure

Samsung Electronics introduces advanced hybrid bonding technologies and ultra-high-layer storage components to maximize bandwidth efficiency in parallel computing systems.

Open-Source Profiler for Edge AI Workloads

Ambiq Micro has released a diagnostic utility designed to provide cycle-level execution metrics for neural network optimization on resource-constrained microcontrollers.

AMD, Supermicro and Spectro Cloud Launch Turnkey Solution

Built on AMD EPYC processors, AMD Instinct GPUs and AMD Pensando networking, the solution is integrated into select Supermicro systems and orchestrated by Spectro Cloud.

Ultra-Wideband Supports Digital Access and Vehicle Presence Detection

BMW Group is deploying NXP Semiconductors’ ultra-wideband technology for secure digital vehicle access and in-cabin presence detection across selected 2026 vehicle programs.

International