01 {{ "2023-12-01T00:00:00+00:00" | date "MMM" }} '23

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Nexperia News

Nexperia’s first SiC MOSFETs raise the bar for safe, robust and reliable power switching in industrial applications

Nexperia has announced its first silicon carbide (SiC) MOSFETs with the release of two 1200 V discrete devices in 3-pin TO-247 packaging with RDS(on) values of 40 mΩ and 80 mΩ.

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01 {{ "2023-12-01T00:00:00+00:00" | date "MMM" }} '23

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Mouser News

Mouser Electronics Unveils Technical Resource Site for Engineering Smart Home Devices

Mouser Electronics the New Product Introduction (NPI) leader™ empowering innovation, explores how to seamlessly connect, control, and automate all our home devices with its all-encompassing Smart Home resource centre.

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01 {{ "2023-12-01T00:00:00+00:00" | date "MMM" }} '23

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Renesas News

Renesas Unveils the First Generation of Own 32-bit RISC-V CPU Core Ahead of Competition

New RISC-V Core Extends Renesas’ Industry-Leading Embedded Processing Portfolio.

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01 {{ "2023-12-01T00:00:00+00:00" | date "MMM" }} '23

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Infineon News

Infineon introduces the industry’s first USB 10 Gbps peripheral controller

The EZ-USB™ family of programmable USB peripheral controllers has continuously advanced features and performance, enabling developers to create USB devices that meet the highest performance requirements in AI, imaging, and emerging applications.

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30 {{ "2023-11-30T00:00:00+00:00" | date "MMM" }} '23

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Steute

steute Technologies restructures its business fields

steute Technologies, an international technology company for top-quality switches, intelligent sensors and innovative wireless systems, has announced a comprehensive restructuring of its business fields.

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30 {{ "2023-11-30T00:00:00+00:00" | date "MMM" }} '23

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Infineon News

Infineon introduces the first 15 V trench power MOSFETs with OptiMOS™ 7 technology in PQFN packages

The ever-increasing power demand in data centers and computing applications requires advancements in power efficiency and compact power supply design.

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30 {{ "2023-11-30T00:00:00+00:00" | date "MMM" }} '23

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CUI Devices News

CUI Devices Expands Waterproof USB Type C Connectors Offering

CUI Devices’ Interconnect Group today announced the continued expansion of its line of waterproof USB Type C connectors.

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30 {{ "2023-11-30T00:00:00+00:00" | date "MMM" }} '23

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STMicroelectronics News

STMICROELECTRONICS PRESENTS QI-COMPLIANT EVALUATION BOARDS

The new evaluation boards accelerate the development of Qi wireless chargers and target a wide range of consumer, medical, and industrial applications.

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29 {{ "2023-11-29T00:00:00+00:00" | date "MMM" }} '23

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Softing Industrial Automation GmbH

OPC UA SDK now with OPC UA Pub/Sub via MQTT - for targeted, resource-saving data transmission

The OPC UA C++ SDK from Softing Industrial has received a major update and now supports OPC UA Pub/Sub via MQTT.

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29 {{ "2023-11-29T00:00:00+00:00" | date "MMM" }} '23

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Infineon News

“Coil on Module” enables ultra-thin electronic data page for Turkish passports with exceptional document durability and protection against forgery

Türkiye has issued nearly five million next-generation electronic passports with contactless Coil on Module (CoM CL) solution from Infineon Technologies AG.

Read more…

Nexperia has announced its first silicon carbide (SiC) MOSFETs with the release of two 1200 V discrete devices in 3-pin TO-247 packaging with RDS(on) values of 40 mΩ and 80 mΩ.

Mouser Electronics the New Product Introduction (NPI) leader™ empowering innovation, explores how to seamlessly connect, control, and automate all our home devices with its all-encompassing Smart Home resource centre.

New RISC-V Core Extends Renesas’ Industry-Leading Embedded Processing Portfolio.

The EZ-USB™ family of programmable USB peripheral controllers has continuously advanced features and performance, enabling developers to create USB devices that meet the highest performance requirements in AI, imaging, and emerging applications.

steute Technologies, an international technology company for top-quality switches, intelligent sensors and innovative wireless systems, has announced a comprehensive restructuring of its business fields.

The ever-increasing power demand in data centers and computing applications requires advancements in power efficiency and compact power supply design.

CUI Devices’ Interconnect Group today announced the continued expansion of its line of waterproof USB Type C connectors.

The new evaluation boards accelerate the development of Qi wireless chargers and target a wide range of consumer, medical, and industrial applications.

The OPC UA C++ SDK from Softing Industrial has received a major update and now supports OPC UA Pub/Sub via MQTT.

Türkiye has issued nearly five million next-generation electronic passports with contactless Coil on Module (CoM CL) solution from Infineon Technologies AG.

International