Available immediately as part of Crucial’s expanded SSD product portfolio, the high-capacity 4TB and value-priced 500GB Crucial X6 versions enable customers to quickly store more documents, videos, music, photos and games.
Schaffner, the international leader in the fields of electromagnetic compatibility and power quality announce the introduction of the new FN3840 for use in Active Infeed Converter (AIC) or Active Front End (AFE) applications where energy is fed back to the power grid.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy.
After a successful integration of DECTRIS ELA® detector into Gatan’s DigitalMicrograph® software and introduction of the Stela camera to their portfolio, the EM manufacture from California is now announcing the DECTRIS-powered hybrid-pixel camera as a low-voltage partner to the Gatan’s GIF Continuum® K3® product line to enable advanced EELS and 4D STEM over the full energy range of today's S/TEM.
Home to one of the nation’s first cross-industry 5G testbeds on it research campus in Upstate New York, GE Research, the technology development arm of the General Electric Company (GE), officially launched two projects as part of the U.S. Department of Defense’s (DOD) recently announced $600 million 5G initiative.
Applied Materials, Inc. today announced materials engineering solutions that give its memory customers three new ways to further scale DRAM and accelerate improvements in chip performance, power, area, cost and time to market (PPACt).