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Microchip News
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Exxelia
Exxelia showcases capacitor and magnetic innovations at Electronica 2026
Visitors can explore advanced film capacitors, CalRamic technologies, integrated magnetics, busbars and stator manufacturing capabilities at Hall A6, Booth 419.
29
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CEVA News
Ceva Unveils Next-Generation NeuPro NPU Portfolio
A common architecture and unified software stack span Physical AI applications from always-on sensors to AI infrastructure.
28
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TDK News
High-Density AC-DC Power Supplies Push Medical Power Limits
High-Power-Density AC-DC Power Supplies for Medical and Industrial Systems.
28
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Microchip News
Radiation-Hardened Multicore RISC-V Processors for Spaceflight Computing
Microchip validated radiation tolerance and initial silicon benchmarks for the PIC64-HPSC architecture to expand onboard autonomous spacecraft processing.
28
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Anduril News
Anduril and Qualcomm to Rebuild American Computer Manufacturing
Beginning with a U.S.-built laptop powered by the Snapdragon X Series platform, BlueChip will establish the manufacturing capabilities and supplier base needed to bring computer production back to America.
28
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Parker News
Parker Chomerics launches reusable thermal gap filler pad
The THERM-A-GAP PAD 30RB delivers 3.0 W/m-K conductivity with excellent rebound for multiple assembly cycles.
28
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STMicroelectronics News
STMicroelectronics Unveils Compact Intelligent Power Modules for Appliances
The SLLIMM series shrinks 600V 3-phase IGBT inverters by 30% for space-constrained motor drives and heat pumps.
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TDK News
High Voltage NTC Temperature Sensors for Power Electronics
TDK Corporation expands its NTC temperature sensor portfolio with M704 and M705 probe assemblies, resolving high-voltage insulation and precise thermal monitoring challenges.
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STMicroelectronics News
