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Weidmueller News
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ZEISS News
ZEISS INRADIA 3D in-line computed tomography for series production
ZEISS presents the ZEISS INRADIA 3D computed tomography system for AI-supported, non-destructive in-line inspection of complex component structures at the cycle times of industrial series production.
13
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Telit News
Telit Cinterion Introduces SE250C4 Smart Module
New series brings local AI acceleration and real-time processing to industrial and connected-device designs.
13
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AMD News
Tamper-Resistant Adaptive SoC Protects Against Backside Physical Attacks
AMD Versal TR devices bond a sensor die to the compute die, securing cryptographic keys in defence and fintech systems.
12
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EMITECH
The Emitech Group steps up its investments and brings RS105 electromagnetic pulse immunity testing in-house
Previously outsourced, the RS105 test under MIL-STD-461 and its NATO equivalent, the NRS03 under AECTP-500, are now carried out by the Emitech Group’s teams in Montigny-le-Bretonneux (Yvelines). This new facility extends the group’s offering, which now covers the full range of MIL-STD-461H tests.
12
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ONSEMI News
EliteSiC M4 Silicon Carbide Platform For Power Systems
onsemi introduces the EliteSiC M4 trench architecture to increase power density and efficiency in electric vehicles and AI data centre power systems.
11
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TDK News
TDK and Microchip Technology partner to enable sensor networks for robotics
TDK sensors, paired with Microchip’s dsPIC33A DSC and LAN8651/LAN8679, bring real-time edge intelligence with single-pair Ethernet connectivity to robotics.
10
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Keyence America
One Scanner, Any Distance: KEYENCE Unveils the BT-A800 Rugged Android™ Mobile Computer
New rugged Android™ handheld computer reads barcodes from 1 inch to 150 feet, runs 40 hours per charge, and ships with an upgrade path to Android™ 21.
09
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Seco News
Industrial Linux Integration for Physical AI and Robotics Hardware
SECO and Peridio integrate a standardized Linux operating system onto Qualcomm Dragonwing hardware for autonomous machines.
06
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Fraunhofer News
