19
'26
Written on
EInfochips News
19
'26
Written on
Siemens News
Semiconductor Test Pattern Execution High Speed Interfaces
Siemens EDA launches Tessent Silicon Executable software to translate and run design-for-test patterns natively across automated test equipment, bench, and system-level environments.
19
'26
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Infineon News
Digital Power-Path Protection for 800-Volt AI Server Architectures
Infineon Technologies introduces a control system designed to manage high-voltage direct current connections and ensure operational stability within scalable data center infrastructure.
16
'26
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TDK News
Multilayer Varistors for Industrial Transient Overvoltage Protection
TDK Corporation expands its surface-mount multilayer varistor family with the X series, solving transient voltage suppression and sustainability challenges in industrial electronics.
16
'26
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Advantech News
Advantech launches AIR-411 edge AI HPC system
The 17-liter workstation integrates Intel Core 200S processors and 300W GPUs for inspection, imaging, and localized LLMs.
15
'26
Written on
Etel News
Planar Air Bearing Platforms for Semiconductor Step-and-Scan Applications
ETEL introduces a full air bearing planar platform designed to support next-generation maskless lithography and optical inspection within the semiconductor ecosystem.
15
'26
Written on
Microchip News
Radiation-Tolerant GaN Point-of-Load Converters for Space Computing Systems
Microchip Technology has released the POL-05-20S-T point-of-load converter to deliver high-current core power for radiation-exposed processing platforms.
15
'26
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Keysight technologies News
Keysight Introduces PCIe 7.0 Protocol Test Solution
Instant link-up and deep protocol visibility reduce risk and shorten next generation system development.
15
'26
Written on
Bodewell Group News
Scaling Through-Glass Via Metallization for Panel-Level Packaging
VON ARDENNE expands semiconductor deposition to panel-level packaging using high-power impulse magnetron sputtering on its HISS platform to resolve through-glass via metallization limits.
14
'26
Written on
ZEISS News
