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TDK News

TDK is Opening up new possibilities in medical 3D imaging

Medical imaging technology has advanced tremendously since Roentgen discovered X-rays at the end of the 1800s. By the 1930s, the more advanced hospitals routinely used the technology as a diagnostic tool for confirming broken bones and even detecting kidney stones. Since those early days, newer technologies have been developed to visualise the inner workings of the human body. Let’s take a look.

Tektronix News

Tektronix Showcases New and Innovative, Precise and Easy-to-Operate Technology Solutions at electronica 2022

Tektronix, Inc., a leading global equipment and software manufacturer delivering innovative, precise and easy-to-operate test, measurement and monitoring solutions, has today announced its participation at this year’s electronica 2022 exhibition, taking place in Munich from November 15-18.

Panasonic Industry News

Panasonic Industry launches new Bluetooth® Low Energy module with 512 kB flash for cost-effective applications that still require high performance

Panasonic Industry Europe has extended its range of Bluetooth® LE modules with the launch of the PAN1782, which targets cost-effective applications that still require high performance, including professional lighting, asset tracking, smart home, advanced wearables, and higher value IoT applications.

Keysight technologies News

Keysight, F5 and AMD Collaborate to Demonstrate 5G Terabit Scale Traffic at Mobile World Congress Las Vegas

Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced that the company’s CyPerf, a software-based cloud native traffic generator, will be used to demonstrate the performance capability of the F5 BIG-IP® Next Edge Firewall cloud-native network function (CNF), powered by the 3rd Gen AMD EPYC processors at AMD’s Booth W1.720, during Mobile World Congress Las Vegas to be held September 28-30, 2022.

TDK News

TDK offers clip-on NTC sensors for heat pumps in e-mobility

TDK Corporation presents the new B58101A0109A* (HP100) series of heat pump sensors for measuring the refrigerant temperature indirectly via the pipes' surface temperature.

Rutronik Info

State-of-the-art sensor fusion with the Rutronik Adapter Board RAB1

Rutronik System Solutions' board family gets a new addition with the RAB1 - Sensorfusion. The adapter board offers its own platform that allows machine learning (ML) based sensor fusion, which forms the basis and the future of artificial intelligence (AI). Equipped with the highest performance sensors from Infineon, Bosch SE, and Sensirion.

Siemens News

Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi-die solution

Siemens Digital Industries Software today introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.

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