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Teledyne SP Devices
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Aratas News
200V High-Isolation Reed Relays for Dense Multichannel Routing
Aratas develops a new series of compact switching components designed to manage high applied voltages within dense multichannel evaluation arrays and safety-monitoring circuitry.
03
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Aetina
Aetina Launches AIE-VX28/18-IP Rugged In-Vehicle AI Platform for Heavy-Duty and Off-Highway Vehicles
IP66-Rated Fanless System Powered by NVIDIA Jetson AGX Orin Supports 12 Camera Inputs for 360-Degree Vision AI on Heavy-Duty Fleets .
03
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CEVA News
Ceva and Mobilint Advance Physical AI with REGULUS Edge AI SoC
First production deployment of Ceva’s NeuPro NPU family combines NeuPro-Nano with SensPro AI DSP to deliver advanced sensing and inference capabilities for Physical AI devices.
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Kontron News
Parallel Testing Boosts 5G Module Manufacturing Quality
Kontron and NOFFZ integrate parallelized robot testing systems to ensure high-frequency quality assurance and traceability in Europe.
30
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Microchip News
Microchip Expands PolarFire FPGA Networking Stack
Industrial edge networking stack enables real-time communications for AI automation, robotics and Industry 4.0 applications.
29
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Exxelia
Exxelia showcases capacitor and magnetic innovations at Electronica 2026
Visitors can explore advanced film capacitors, CalRamic technologies, integrated magnetics, busbars and stator manufacturing capabilities at Hall A6, Booth 419.
29
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CEVA News
Ceva Unveils Next-Generation NeuPro NPU Portfolio
A common architecture and unified software stack span Physical AI applications from always-on sensors to AI infrastructure.
28
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TDK News
High-Density AC-DC Power Supplies Push Medical Power Limits
High-Power-Density AC-DC Power Supplies for Medical and Industrial Systems.
28
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Microchip News
