New workflows automate RTL checks, debugging and planning while remaining compatible with existing EDA environments and cloud-based development infrastructures.

Siemens is collaborating with TSMC on certifications and innovative design solutions at the OIP Forum, accelerating 3D IC and AI-driven circuit and systems design for mutual customers using TSMC's advanced process technologies.

Collaboration enhances Open Innovation Platform, accelerating semiconductor design with cutting-edge tools, boosting efficiency, and enabling next-gen chip technologies for future applications.

For the first time, high-fidelity thermal simulation data can be shared in the electronic supply chain while protecting semiconductor OEM’s intellectual property.

Collaboration between Siemens, sureCore and Semiwise to develop cryogenic semiconductor designs capable of operating in extreme cold conditions required for quantum computing.

Siemens Digital Industries Software today announced that Samsung Foundry’s advanced 3nm process technology now supports Siemens’ entire Calibre^® nmPlatform tool, which is the industry’s leading solution for physical verification of next-generation integrated circuits (ICs).

Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.

Siemens Digital Industries Software today announced a range of expanded electronic design automation (EDA) early design verification functionalities for its Calibre^® platform for integrated circuit (IC) physical verification.

At the TSMC 2022 Technology Symposium, Siemens Digital Industries Software today announced that its ongoing collaboration with longtime foundry partner TSMC has resulted in new product certifications for several of Siemens’ most advanced toolsets.

Siemens Digital Industries Software today announced that its Analog FastSPICE (AFS) platform is now certified for United Microelectronics Corporation’s (UMC) 28nm high-performance, low-power process technology. With this certification, customers using Siemens‘ AFS platform can now leverage the performance enhancement and power efficiency of UMC‘s proven 28HPC U+ process for their next-generation analog/mixed-signal designs.