Sivers and Doosan launch a USD 1.5M program to develop scalable Ka-band ESA panels powered by advanced multi-beam SATCOM BFICs.

Sivers Semiconductors wins a $3M order as Tachyon adopts its TRB02801-based 28GHz antenna modules to advance scalable mmWave FWA deployments from 2026.

Sivers and POET combine DFB laser technology with the Optical Interposer platform to deliver scalable light-engines for next-generation AI datacenter connectivity.

Sivers Semiconductors joins the DIFI Consortium to advance open standards in satellite communications, leveraging its mmWave and RF expertise to support next-generation interoperability.

Sivers Semiconductors and Nisko Projects partner to penetrate Israel’s growing $630M SATCOM and 5G markets with mmWave/RF solutions for defense and telecom applications.

Sivers Semiconductors partners with O-Net Technologies to integrate advanced DFB lasers into next-generation optical modules, driving energy-efficient networking for AI data centers and co-packaged optics.

New wireless solutions enable Sivers to increase market dominance, while delivering greater value to customers by accelerating their time to market.

Sivers Semiconductors has secured $11.6M in funding through the U.S. CHIPS and Science Act for 5G/6G and Electronic Warfare chip development, partnering with BAE Systems, Raytheon, and Ericsson.

Sivers Semiconductors will design and develop advanced 5G long range antenna modules that operate within the 57-71 GHz license exempt band, providing high-speed broadband communication links for track-to-train applications.

Sivers Semiconductors announces that its subsidiary, Sivers Photonics, in collaboration with ecosystem partners,is demonstrating its advanced laser chip and array technology at the Optical Fiber Communication (OFC) Conference in San Diego on March 24-28, 2024.