Quantum technologies are progressing from research into commercial development, with chips, sensors and secure communications following different paths toward market adoption.

Analysis of the ten latest component announcements featured on electronique-news.com highlights significant advances in power MOSFET technology.

The launches of silicon carbide (SiC) electronic components and modules documented during the first half of 2026 confirm the growing adoption of this wide-bandgap semiconductor.

The Process Design Kit (PDK) forms the essential technical foundation for designing an integrated circuit that can be manufactured using a given fabrication process.

The so-called Design-Technology Co-Optimization (DTCO) approach has become a central element in the development of next-generation integrated circuits and associated electronic architectures.

The first FPGA was introduced to the market by Xilinx in 1985. Since then, FPGAs have found their way into a wide range of applications, from high-performance computing and embedded digital processing to integrated circuit prototyping. They stand out for their reconfigurability and significant parallel processing capabilities. Written by Youssef Belgnaoui.

RFID (Radio Frequency Identification) tags are used for asset recognition through digital encoding technology. These tags use an antenna, an electronic chip, or an integrated circuit to send and receive data. Written by Y. Belgnaoui.

Innovations in eco-friendly materials, closed-loop manufacturing, sustainable product design, and recycling systems offer a new vision for the future of electronics, writes K.A. Gerardino.

The semiconductor industry, just like any other field, is prone to undergoing periods of diversification and consolidation, whether through organic or inorganic growth – K.A. Gerardino.

While the worst of the chip crisis appears to be over, the situation is not yet normal and supply constraints are expected to last till end 2024 - By Milton D'Silva.