Fraunhofer IPMS introduced advanced wafer surface contamination analysis services to help semiconductor manufacturers detect ultratrace elements and improve semiconductor production quality.

New IP Core enables deterministic Ethernet communication at up to 10 Gbit/s for automotive, industrial and safety-critical networks.

New interdigital electrode chips enable parallel, high-precision material testing, accelerating development of organic electronic devices and sensor technologies.

Fraunhofer IPMS and DIVE have installed an optical measuring device that reduces inspection efforts during wafer production and enables more sustainable semiconductor manufacturing.

Fraunhofer IPMS develops energy-efficient TSN testbed using Li-Fi, enabling real-time wireless data for mobile industrial automation applications.

The evaluation kits include tilting and piston micro mirrors, enabling precise light modulation for quantum, medical, and optical applications.

Vuzix and Fraunhofer IPMS 1080p+ microLED backplane with green microLEDs and red OLED pixels.

Fraunhofer IPMS presents a new high-voltage CMOS backplane for especially bright, long-lasting microdisplays with stacked OLEDs at SID Display Week 2025.

Innovative demonstrator combines multimodal sensors and AI to detect machine issues early and reduce downtime.

Fraunhofer researchers are developing solutions for automated, nondestructive robotic disassembly of electronics for remanufacturing and material recycling that will help establish an advanced circular economy.