To address the growing demand for improved signal quality in application development, ROHM has now developed a second-generation terahertz wave oscillation device.

ROHM introduces surface-mount power devices with standard footprint compatibility, designed to enhance server power supply efficiency and support high-density industrial applications.

ROHM develops a surface-mount package architecture designed to maximize thermal dissipation and high-voltage insulation in automotive and industrial power conversion systems.

A browser-based platform for rapid loss and thermal analysis helps engineers evaluate power semiconductor choices before hardware prototyping.

Compact receiver and transmitter ICs support proximity-based power transfer for ultra-small devices, addressing design constraints in next-generation wearable electronics.

New devices reduce on-resistance by 30% at high temperatures, improving power conversion in EVs, AI servers, and industrial systems.

New CMOS op amps target automotive, industrial and consumer applications requiring accurate signal amplification and low-noise analog design.

Licensing TSMC’s 650V GaN process technology enables in-house wafer fabrication at ROHM Hamamatsu, strengthening supply continuity for high-voltage AI server and EV power systems.

ROHM expands its regulator lineup for 12 V and 24 V systems, targeting space-constrained automotive, industrial and communications power designs.

ROHM introduces low-profile SiC MOSFETs in TOLL packages engineered to enhance thermal efficiency and power density in compact industrial and energy systems.