Technical Enclosure Solutions and Printed Electronics at electronica 2026

Modern industrial applications require enclosure systems that combine mechanical protection with integrated thermal management and functional extensions. At the electronica trade fair in Munich, BOPLA presents new technological approaches for electronic assemblies. The focus is on the BoNext electronic enclosure, the scalable BoVersa system, and printed electronics components for sensor and communication applications.

Modular Enclosure Systems for Industrial and IoT Applications
The new BoNext electronic enclosure was developed for sensitive electronics, combining enclosure design with technical protection mechanisms. The construction offers dust and water protection expandable up to IP68, flame-retardant and self-extinguishing polycarbonate according to UL 94 V-0, and modern design with integrated ambient lighting. For applications with increased thermal requirements, the scalable BoVersa enclosure system offers flexible combination options for the bottom section, functional cover, and design cover. The aluminum bottom sections feature a point-symmetric cooling fin design for optimized heat dissipation, making the system suitable for wireless applications, IoT, and embedded systems. The versions achieve IP66/68 protection classes and an impact resistance of IK08.

Printed Electronics for Thermal and Communicative Integration
To prevent visual impairments caused by ice and condensation on outdoor cameras and sensors, BOPLA develops transparent film heaters based on conductive metal mesh structures embedded in a transparent carrier film. These enable a heating output of up to 3,000 W/m² at temperatures up to 85 °C and a transparency of up to 93 %. Additionally, transparent antennas made of fine metal mesh structures enable flat, flexible, and nearly invisible integration into surfaces for RFID, NFC, WiFi, and 5G/6G applications with shielding of up to 60 dB at approximately 80 % transmission. The portfolio at the exhibition booth is complemented by explosion-protected enclosures, stainless steel flange enclosures, and panel PCs from ROSE Systemtechnik GmbH.

Additional Context: 
This section details technical specifications and competitive benchmarking not included in the original product announcement

In the field of modular industrial enclosures, systems like the BoVersa series compete with aluminum and plastic profile enclosures from various manufacturers, focusing on standardized protection classes such as IP66/68 and mechanical robustness according to IK08. Transparent film heaters and conductive metal mesh structures position themselves in the market for ADAS camera systems and lidar sensors as a planar alternative to conventional wire heaters, maintaining optical properties through high transmission while providing defined heating outputs up to 3,000 W/m².

Edited by Sucithra Mani, Induportals editor – adapted by AI.

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