08 Feb '20

Written on February 8, 2020

Flir News

FLIR Introduces Next Generation of Compact, High-Definition Thermal Science Cameras

Introducing the FLIR A8580 series of thermal science cameras: a 1.3 megapixel, cooled camera designed for a wide range of industrial, military, science, and product research and development (R&D) applications.

Read more…

08 Feb '20

Written on February 8, 2020

ST News

STMicroelectronics Unveils Secure Cellular-Connectivity Offering for Industrial IoT and Automotive Applications

ST4SIM offering includes automotive- and industrial-grade embedded SIM (eSIM) SoCs in addition to standard machine-to-machine SIM.

Read more…

08 Feb '20

Written on February 8, 2020

Toshiba News

Toshiba launches new high-resolution micro-stepping motor driver IC with integrated current sensing

New device offers low BOM cost, high motor current and ultra-silent operation.

Read more…

08 Feb '20

Written on February 8, 2020

Congatec News

From high-end to ultra-low-power edge servers

congatec to focus on embedded edge computing at Embedded World.

Read more…

06 Feb '20

Written on February 6, 2020

ONSEMI news

LiDAR Partners Program: Bringing the Ecosystem Together

The need for automation in factory and industrial settings will continually increase in the coming years, at the same time as the autonomous driving revolution.

Read more…

06 Feb '20

Written on February 6, 2020

Mouser News

Mouser Electronics Now Stocking Industry 4.0-Focused Bosch Sense Connect Detect Module

The industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the Sense Connect Detect (SCD) module from Bosch.

Read more…

05 Feb '20

Written on February 5, 2020

ST News

STMicroelectronics Blends Performance, Integration and Efficiency for Smart Devices in New STM32H7 Product Lines

The latest STM32H7A3, STM32H7B3, and STM32H7B0 Value Line microcontrollers (MCUs) combine 280MHz Arm^® Cortex^®-M7 core performance, high memory density, and power savings for future generations of smart objects.

Read more…

05 Feb '20

Written on February 5, 2020

GEA GROUP News

IPPE 2020: GEA OxyCheck cleared to enter the U.S. market

GEA received FDA approval for sensor technology used to monitor food packaging quality.

Read more…

05 Feb '20

Written on February 5, 2020

ONSEMI news

ON Semiconductor Launches Automotive LED Drivers and Controllers for Advanced Vehicle Lighting Applications

New family of devices simplifies task of designing efficient and reliable lighting solutions with sophisticated functionality to enhance road safety.

Read more…

05 Feb '20

Written on February 5, 2020

FOBA News

FOBA Upgrades Portfolio with New Fiber Laser Marking System

FOBA Laser Marking + Engraving, a global leader in industrial laser part marking and engraving solutions, has introduced another laser marker for line integration: The new FOBA Y.0200-S model is an upgrade to the existing range of fiber laser marking systems. The powerful marking laser is characterized by its compact design and gives manufacturers a high amount of marking and mounting versatility.

Read more…

Market Overview

Sustainability in Electronic Components: Eco-Friendly Materials and Recycling Initiatives

Technical Articles

Toshiba Cuts Losses in SiC MOSFETs and Diodes

Case studies

Optimizing Wafer and Die Inspections

FLIR Introduces Next Generation of Compact, High-Definition Thermal Science Cameras

Introducing the FLIR A8580 series of thermal science cameras: a 1.3 megapixel, cooled camera designed for a wide range of industrial, military, science, and product research and development (R&D) applications.

STMicroelectronics Unveils Secure Cellular-Connectivity Offering for Industrial IoT and Automotive Applications

ST4SIM offering includes automotive- and industrial-grade embedded SIM (eSIM) SoCs in addition to standard machine-to-machine SIM.

Toshiba launches new high-resolution micro-stepping motor driver IC with integrated current sensing

New device offers low BOM cost, high motor current and ultra-silent operation.

From high-end to ultra-low-power edge servers

congatec to focus on embedded edge computing at Embedded World.

LiDAR Partners Program: Bringing the Ecosystem Together

The need for automation in factory and industrial settings will continually increase in the coming years, at the same time as the autonomous driving revolution.

Mouser Electronics Now Stocking Industry 4.0-Focused Bosch Sense Connect Detect Module

The industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the Sense Connect Detect (SCD) module from Bosch.

STMicroelectronics Blends Performance, Integration and Efficiency for Smart Devices in New STM32H7 Product Lines

The latest STM32H7A3, STM32H7B3, and STM32H7B0 Value Line microcontrollers (MCUs) combine 280MHz Arm^® Cortex^®-M7 core performance, high memory density, and power savings for future generations of smart objects.

IPPE 2020: GEA OxyCheck cleared to enter the U.S. market

GEA received FDA approval for sensor technology used to monitor food packaging quality.

ON Semiconductor Launches Automotive LED Drivers and Controllers for Advanced Vehicle Lighting Applications

New family of devices simplifies task of designing efficient and reliable lighting solutions with sophisticated functionality to enhance road safety.

FOBA Upgrades Portfolio with New Fiber Laser Marking System

International

Market Overview

Technical Articles

Case studies

Introducing the FLIR A8580 series of thermal science cameras: a 1.3 megapixel, cooled camera designed for a wide range of industrial, military, science, and product research and development (R&D) applications.

ST4SIM offering includes automotive- and industrial-grade embedded SIM (eSIM) SoCs in addition to standard machine-to-machine SIM.

New device offers low BOM cost, high motor current and ultra-silent operation.

congatec to focus on embedded edge computing at Embedded World.

The need for automation in factory and industrial settings will continually increase in the coming years, at the same time as the autonomous driving revolution.

The industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the Sense Connect Detect (SCD) module from Bosch.

The latest STM32H7A3, STM32H7B3, and STM32H7B0 Value Line microcontrollers (MCUs) combine 280MHz Arm® Cortex®-M7 core performance, high memory density, and power savings for future generations of smart objects.

GEA received FDA approval for sensor technology used to monitor food packaging quality.

New family of devices simplifies task of designing efficient and reliable lighting solutions with sophisticated functionality to enhance road safety.

International

The latest STM32H7A3, STM32H7B3, and STM32H7B0 Value Line microcontrollers (MCUs) combine 280MHz Arm^® Cortex^®-M7 core performance, high memory density, and power savings for future generations of smart objects.