03
'20
Written on
Elesa + Ganter News
03
'20
Written on
Rohde & Schwarz
Rohde & Schwarz and MediaTek verify dynamic spectrum sharing (DSS) for 5G NR
Today, frequencies below 6 GHz are heavily utilized due to the successful deployment of 4G LTE. This creates a challenge for network operators worldwide on how to deploy 5G NR at these low frequency bands. Dynamic spectrum sharing (DSS) is a technique that enables mobile network operators to use LTE and 5G NR in the same frequency band. The in-depth validation of the standardized coexistence methodology is key to the success of this technology. Rohde & Schwarz and MediaTek have leveraged their unique expertises through a collaboration, with the resulting verification that uses the R&S CMX500 5G NR radio communication tester platform by Rohde & Schwarz and a device under test (DUT) provided by MediaTek.
03
'20
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ONSEMI news
ON Semiconductor Announces Innovative New USB-C™ PD 3.0 Controllers with Advanced Feature Sets and Enhanced Efficiency
New USB-C Power Delivery (PD) 3.0 Devices provide market-leading solutions for power adapter and battery charger applications.
02
'20
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Toshiba News
Toshiba announces new cutting-edge CMOS silicon on insulator process
New process will enhance the noise figure of RF switches and low noise amplifiers for 5G and Wi-Fi applications.
02
'20
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TDK News
New Data Book for aluminum electrolytic capacitors
TDK Corporation presents the fully revised Data Book for aluminum electrolytic capacitors with screw terminal, snap-in, axial and single-ended design.
02
'20
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Stemmer imaging News
Easy 3D Plug & Play with Zivid One+
STEMMER IMAGING has extended its portfolio with the Zivid One+ 3D colour cameras from the Norwegian supplier Zivid since summer 2019. Our product manager Tim Huylebrouck describes his first experience with the 3D cameras.
02
'20
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Hexagon Manufacturing Intelligence News
Hexagon launches new entry-level optical CMM for the Asia-Pacific region
Captura is an easy to use CMM that provides multisensor measurement at an affordable price point.
28
'20
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Kontron News
COM-HPC™ - Higher performance for Computer-on-Modules
Peter Müller, Vice President Product Center Modules at Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), comments on the background to the development of the new Computer-On-Module standard COM-HPC™:
28
'20
Written on
Bender News
Residual current monitoring up to the final circuit
In modern electrical systems, extensive monitoring by a wide range of sensors is often required in order to detect incipient insulation deterioration at an early stage and thus ensure both safety and high availability.
28
'20
Written on
Congatec News
