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ANSYS News
TSMC CERTIFIES ANSYS MULTIPHYSICS SOLUTIONS FOR N2 SILICON PROCESS
Ansys is certified for TSMC’s N2 process, including thermal self-heat effects for greater chip reliability and more optimized designs.
On-die thermal/self-heat analysis in Ansys RedHawk-SC
Ansys and TSMC continue their long-standing technology collaboration to announce the certification of Ansys’ power integrity software for TSMC’s N2 process technology. The TSMC N2 process, which adopts a nanosheet transistor structure, represents a major advancement in semiconductor technology with significant speed and power advantages for high-performance computing (HPC), mobile chips, and 3D-IC chiplets.
Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on N2, including the effects of self-heat on the long-term reliability of wires and transistors. This latest collaboration builds on the recent certification of the Ansys platform for TSMC’s N4 and N3E FinFLEX processes.
As technology scaling continues, the self-heating effect from switching devices and current conduction in interconnects can affect circuit reliability. Ansys and TSMC have collaborated to correctly model this with a heatsink-aware flow that increases thermal predictive accuracy by taking into consideration the heat conduction to neighbouring wires that may cool a local hot spot. These calculations allow designers to assess margins with predictive accuracy and increase circuit performance by avoiding wasteful over-design.
Ansys and TSMC continue their long-standing technology collaboration to announce the certification of Ansys’ power integrity software for TSMC’s N2 process technology. The TSMC N2 process, which adopts a nanosheet transistor structure, represents a major advancement in semiconductor technology with significant speed and power advantages for high-performance computing (HPC), mobile chips, and 3D-IC chiplets.
Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on N2, including the effects of self-heat on the long-term reliability of wires and transistors. This latest collaboration builds on the recent certification of the Ansys platform for TSMC’s N4 and N3E FinFLEX processes.
As technology scaling continues, the self-heating effect from switching devices and current conduction in interconnects can affect circuit reliability. Ansys and TSMC have collaborated to correctly model this with a heatsink-aware flow that increases thermal predictive accuracy by taking into consideration the heat conduction to neighbouring wires that may cool a local hot spot. These calculations allow designers to assess margins with predictive accuracy and increase circuit performance by avoiding wasteful over-design.
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