20
'24
Written on
DTP
20
'24
Written on
AMD News
AMD Unveils Versal Premium Series Gen 2 for Advanced System Acceleration
The industry-first adaptive SoC features CXL 3.1, PCIe Gen6, and LPDDR5X support, delivering faster data movement, enhanced memory utilization, and secure connectivity for data-intensive applications.
20
'24
Written on
Würth Elektronik News
Würth Elektronik Introduces Daphnis-I LoRaWAN Module for IoT Applications
The Daphnis-I module supports long-range communication, ideal for IoT solutions in smart cities, agriculture, logistics, and Industry 4.0, with ultra-low power consumption and flexible integration options.
20
'24
Written on
ANSYS News
Ansys Accelerates CFD Simulation by 110x with NVIDIA GH200 Grace Hopper Superchips
Ansys Fluent coupled with NVIDIA accelerated computing significantly speeds large-scale CFD simulations, reducing run time from four weeks to six hours.
20
'24
Written on
Keysight technologies News
Keysight Introduces Electronic Design Automation Software Suite
Keysight’s suite of EDA tools leverages AI, machine learning (ML), and Python integrations to dramatically reduce design time for complex RF and chiplet products.
19
'24
Written on
innodisk
Innodisk Launches High-Performance CXL Memory Module for AI Servers
Innodisk's new CXL memory module boosts AI server efficiency with 40% more bandwidth and 30% higher capacity, addressing rising demands in AI and cloud data centers.
19
'24
Written on
Alliance Memory News
Alliance Memory Expands Serial NOR Flash Portfolio With New High-Density Devices
Alliance Memory has announced the expansion of its Serial NOR Flash product line with the introduction of three new 3.3 V families with density of 128Mb, 256Mb, and 512Mb.
19
'24
Written on
innodisk
Innodisk Launches E1.S SSD to Support Next-Generation Edge Computing and AI Advancements
Designed for the edge computing era, Innodisk’s E1.S SSD aims to boost performance in AI and edge applications with high reliability and efficiency.
18
'24
Written on
Alphawave Semi News
Alphawave Semi Showcases AI Connectivity Breakthroughs at Supercomputing 2024
Demonstrations include the industry’s first PCIe 6/1.6T Ethernet I/O chiplet, 128 Gbps PCIe 7.0 over copper, and advanced optical interconnects for AI, HPC, and hyperscale data centers.
16
'24
Written on
Wise-integration News
