27
'24
Written on
Infineon News
27
'24
Written on
Rohm Semiconductors News
Valeo & ROHM Semiconductor co-develop the next generation of power electronics
Valeo & ROHM, collaborate to propose and optimize the next generation of power modules for electric motor inverters using their combined expertise in power electronics management.
26
'24
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Alphawave Semi News
Alphawave Semi Powers Rebellions Breakthrough AI Accelerator with Advanced Chiplet Technology
Rebellions has partnered with Alphawave Semi's I/O chiplets to enhance performance and scalability for hyperscale AI workloads, promoting innovation through energy-efficient, modular solutions.
26
'24
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Rohde & Schwarz
Rohde & Schwarz and ETS-Lindgren partner to offer OTA testing solutions for next gen wireless technologies
Rohde & Schwarz and ETS-Lindgren continue their long standing partnership to deliver comprehensive over the air (OTA) testing solutions for next generation wireless technologies.
26
'24
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MURATA News
Murata Launches Compact Wi-Fi HaLow Modules for Long-Range IoT
The Type 2HK and 2HL modules provide high-speed communication over 1km for smart IoT applications, enhancing connectivity for consumer industrial and medical devices with efficient power consumption.
25
'24
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Infineon News
AURIX TC3x from Infineon supports FreeRTOS
Infineon Technologies AG has added FreeRTOS support for its AURIX TC3x microcontrollers (MCUs).
22
'24
Written on
Melexis News
Melexis Introduces Coreless MLX91235 Current Sensor
The MLX91235 current sensor eliminates the ferromagnetic core for a compact, high-speed solution, providing enhanced accuracy, digital calibration, and functional safety in automotive and industrial applications.
22
'24
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Toshiba News
Toshiba releases high-speed photorelay for semiconductor testers
Particularly suitable for the pin electronics of semiconductor testers, the TLP3450S makes measuring devices-under-test (DUTs) at fast speeds more precise.
22
'24
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ANSYS News
Ansys to Drive Major Advances in AI-Powered Semiconductor Design Using NVIDIA AI
Integration of NVIDIA Modulus AI framework with the Ansys SeaScape platform will enable engineers to easily build customized AI solutions that can improve designer productivity and quickly identify optimal design configurations.
22
'24
Written on
SK Hynix News
