22 {{ "2024-07-22T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-07-22T00:00:00+00:00" | date "longDate" }}

ANSYS News

ANSYS WORKS WITH SUPERMICRO AND NVIDIA TO DELIVER UNMATCHED MULTIPHYSICS SIMULATION WITH TURNKEY HARDWARE

Collaboration optimizes Ansys solutions and AI capabilities, boosts simulation speeds up to 1,600x.

Read more…

22 {{ "2024-07-22T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-07-22T00:00:00+00:00" | date "longDate" }}

Toshiba News

TOSHIBA EXTENDS 150V N-CHANNEL POWER U-MOS X-H MOSFET LINEUP TO REDUCE POWER CONSUMPTION FOR POWER SUPPLIES

New additions have improved reverse recovery characteristics that a critical for synchronous rectification applications.

Read more…

22 {{ "2024-07-22T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-07-22T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

KEYSIGHT INTRODUCES SYSTEM DESIGNER FOR PCIE AND CHIPLET PHY DESIGNER FOR DIGITAL STANDARDS-DRIVEN SIMULATION WORKFLOWS

System Designer for PCIe is an intelligent design environment for modelling and simulating the latest PCIe Gen5 and Gen6 systems.

Read more…

20 {{ "2024-07-20T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-07-20T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Introduces Power Management with Voltage Monitoring Solution for Space-Grade AMD Versal AI Edge Adaptive SoC

Space-Qualified Power Management Solution Offers Cost-Effective Digital Wrapper and System Health Monitoring through an Intuitive Graphical User Interface.

Read more…

20 {{ "2024-07-20T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-07-20T00:00:00+00:00" | date "longDate" }}

MIkroe News

Click Snap from MIKROE reduces size, weight and power for final phase prototyping

MIKROE has announced a new feature, to be rolled our across its range of Click boards™, which reduces size, weight and power consumption for second level prototyping and production.

Read more…

19 {{ "2024-07-19T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-07-19T00:00:00+00:00" | date "longDate" }}

Toshiba News

TOSHIBA LAUNCHES NEW SERIES OF EFUSE ICS, ELECTRONIC FUSES THAT CAN BE USED REPEATEDLY

The product lineup offers eight products that are suitable for overvoltage protection of a range of power supply voltages.

Read more…

18 {{ "2024-07-18T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-07-18T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

uEye ACP series provides added customization options for board-level cameras

Cost-effective from lot size one, readily available, highly variable.

Read more…

18 {{ "2024-07-18T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-07-18T00:00:00+00:00" | date "longDate" }}

PickeringTest News

Pickering Introduces Low-Leakage Switched Guard Modules for Semiconductor Testing

Pickering Interfaces has announced a family of low leakage switching solutions targeting very low current driven-guard measurements in semiconductor parametric test applications such as WAT (wafer acceptance testing).

Read more…

18 {{ "2024-07-18T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-07-18T00:00:00+00:00" | date "longDate" }}

Vishay News

New Vishay Intertechnology 890 nm IR Emitting Diode Offers High Typical Radiant Intensity of 235 mW/sr and Fast Switching Times of 15 ns

Built on Surface Emitter Technology, High Speed Device Features Excellent Temperature Coefficient of VF of -1.0 mV/K.

Read more…

18 {{ "2024-07-18T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-07-18T00:00:00+00:00" | date "longDate" }}

Würth Elektronik news

WÜRTH ELEKTRONIK DEFINES AN ELECTRICAL PROPERTY FOR MOLDED INDUCTORS

The molded inductors from the Power Magnetics product portfolio are now successively supplemented with the value of the maximum operating voltage Vop as a new parameter in the specifications.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

ANSYS WORKS WITH SUPERMICRO AND NVIDIA TO DELIVER UNMATCHED MULTIPHYSICS SIMULATION WITH TURNKEY HARDWARE

Collaboration optimizes Ansys solutions and AI capabilities, boosts simulation speeds up to 1,600x.

TOSHIBA EXTENDS 150V N-CHANNEL POWER U-MOS X-H MOSFET LINEUP TO REDUCE POWER CONSUMPTION FOR POWER SUPPLIES

New additions have improved reverse recovery characteristics that a critical for synchronous rectification applications.

KEYSIGHT INTRODUCES SYSTEM DESIGNER FOR PCIE AND CHIPLET PHY DESIGNER FOR DIGITAL STANDARDS-DRIVEN SIMULATION WORKFLOWS

System Designer for PCIe is an intelligent design environment for modelling and simulating the latest PCIe Gen5 and Gen6 systems.

Renesas Introduces Power Management with Voltage Monitoring Solution for Space-Grade AMD Versal AI Edge Adaptive SoC

Space-Qualified Power Management Solution Offers Cost-Effective Digital Wrapper and System Health Monitoring through an Intuitive Graphical User Interface.

Click Snap from MIKROE reduces size, weight and power for final phase prototyping

MIKROE has announced a new feature, to be rolled our across its range of Click boards™, which reduces size, weight and power consumption for second level prototyping and production.

TOSHIBA LAUNCHES NEW SERIES OF EFUSE ICS, ELECTRONIC FUSES THAT CAN BE USED REPEATEDLY

The product lineup offers eight products that are suitable for overvoltage protection of a range of power supply voltages.

uEye ACP series provides added customization options for board-level cameras

Cost-effective from lot size one, readily available, highly variable.

Pickering Introduces Low-Leakage Switched Guard Modules for Semiconductor Testing

Pickering Interfaces has announced a family of low leakage switching solutions targeting very low current driven-guard measurements in semiconductor parametric test applications such as WAT (wafer acceptance testing).

New Vishay Intertechnology 890 nm IR Emitting Diode Offers High Typical Radiant Intensity of 235 mW/sr and Fast Switching Times of 15 ns

Built on Surface Emitter Technology, High Speed Device Features Excellent Temperature Coefficient of VF of -1.0 mV/K.

WÜRTH ELEKTRONIK DEFINES AN ELECTRICAL PROPERTY FOR MOLDED INDUCTORS

The molded inductors from the Power Magnetics product portfolio are now successively supplemented with the value of the maximum operating voltage Vop as a new parameter in the specifications.

International