TDK Corporation presents the new B58101A0109A* (HP100) series of heat pump sensors for measuring the refrigerant temperature indirectly via the pipes' surface temperature.
Rutronik System Solutions' board family gets a new addition with the RAB1 - Sensorfusion. The adapter board offers its own platform that allows machine learning (ML) based sensor fusion, which forms the basis and the future of artificial intelligence (AI). Equipped with the highest performance sensors from Infineon, Bosch SE, and Sensirion.
Siemens Digital Industries Software today introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.
Diodes Incorporated today announced the latest addition to its broad portfolio of ReDrivers with the release of a 1.8V low-power, 4 data lanes 2.5Gbps ReDriver.
Rohde & Schwarz is adding a completely new series to its oscilloscope portfolio that delivers a number of industry firsts. The new R&S MXO 4 series oscilloscopes feature the world’s fastest real-time update rate of over 4.5 million acquisitions per second. Development engineers can now see more signal detail and infrequent events than with any other oscilloscope.
U-blox, a leading global provider of positioning and wireless communication technologies and services, announced today that Move-X has chosen to integrate u-blox positioning technology and u-blox cloud positioning service in their new LoRa connectivity solution - the Cicerone board.
Ampleon will showcase at the European Microwave Week (held in Milan between 27 thru 29 September) our latest solutions and innovative products in GaN and LDMOS technologies. Among the products on display will be ones aimed at wireless infrastructure, avionics/defence, non-cellular communication, cooking/ defrosting, and ISM-related applications.