28
'22
Written on
Renesas News
28
'22
Written on
Siemens News
Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi-die solution
Siemens Digital Industries Software today introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.
28
'22
Written on
Diodes Incorporated News
Low-Power 1.8V, 2.5Gbps, 4 Data Lane ReDriver from Diodes Incorporated Supports MIPI D-PHY Protocols
Diodes Incorporated today announced the latest addition to its broad portfolio of ReDrivers with the release of a 1.8V low-power, 4 data lanes 2.5Gbps ReDriver.
28
'22
Written on
Rohde & Schwarz
Rohde & Schwarz introduces the R&S MXO 4 series, the next generation oscilloscopes for accelerated insight
Rohde & Schwarz is adding a completely new series to its oscilloscope portfolio that delivers a number of industry firsts. The new R&S MXO 4 series oscilloscopes feature the world’s fastest real-time update rate of over 4.5 million acquisitions per second. Development engineers can now see more signal detail and infrequent events than with any other oscilloscope.
27
'22
Written on
U Blox News
Move-X chooses u-blox chip-to-cloud positioning solution for its new Cicerone board LoRa connectivity solution
U-blox, a leading global provider of positioning and wireless communication technologies and services, announced today that Move-X has chosen to integrate u-blox positioning technology and u-blox cloud positioning service in their new LoRa connectivity solution - the Cicerone board.
27
'22
Written on
Ampleon News
Ampleon’s “New” standard for L Band, GaN-SiC HEMT
Ampleon will showcase at the European Microwave Week (held in Milan between 27 thru 29 September) our latest solutions and innovative products in GaN and LDMOS technologies. Among the products on display will be ones aimed at wireless infrastructure, avionics/defence, non-cellular communication, cooking/ defrosting, and ISM-related applications.
26
'22
Written on
ST News
Highly integrated PFC boost controllers from STMicroelectronics eliminate startup-circuit design challenges
STMicroelectronics’ L4985A/B and L4986A/B power-factor correction (PFC) boost controllers simplify design and enhance flexibility by integrating 800V startup circuitry and additional valuable proprietary features.
26
'22
Written on
Snapeda News
Amphenol launches the SnapEDA Viewer with over 21,000 free ready-to-use CAD models for hardware design
Engineers can design faster with free E-CAD and M-CAD models for Amphenol Communication Solutions (ACS) connectors available on the Amphenol.
26
'22
Written on
Sivers Semiconductors News
Sivers Semiconductors exhibits and presents at Wi-Fi World Congress Europe 2022
Sivers Semiconductors AB announces today that its subsidiary Sivers Wireless will participate at Wi-Fi World Congress Europe 2022 in Stockholm, Sweden, with both exhibition and speaker.
26
'22
Written on
Lane Electronics News
