Conta-Clip introduces the new, inverse and modular KDSI-SR cable entry system for reliable sealing, maximum flexibility and time savings feed-through for cables with and without plugs.
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, proudly announces that it has received the 2021 Global High-Service Distributor of the Year award from Littelfuse, an industrial technology manufacturing company empowering a sustainable, connected, and safer world.
Today, we have more choice than ever when it comes to machine vision camera sensors and models. Beyond, megapixels and speed, a good place start narrowing down camera choices is with EMVA 1288 information. These specifications allow the comparison of the image quality of cameras and sensors such as read noise or how well they might perform in low light conditions.
The new chips enable I3C control plane networks with multiple initiator controllers, such as CPU and Baseboard Management Controllers (BMC), to support targets across a large physical network running at full speed by improving signal integrity and reducing capacitive loading. They also support heterogeneous designs by providing IO level shifting and protocol translation for mixed I2C/SMBus and I3C networks.
This year, Intel has committed to achieve net-zero greenhouse gas emissions in our global operations by 2040 and to develop more sustainable technology solutions. Keeping up with the insatiable demands for computing while creating a sustainable future is one of the biggest challenges for high performance computing (HPC). While daunting, it is achievable if we address every part of the HPC compute stack – silicon, software, and systems.
Thalia Design Automation Ltd., provider of analog and mixed-signal circuit IP reuse platform, today announced its core Design Enabler product has been enhanced to significantly boost the value it brings to product development teams in both optimizing the performance of migrated designs and improving or preserving layout.
Tektronix, Inc. has announced details on the 2022 Tektronix Innovation Forum, offering engineers and scientists around the world 30+ classes on the latest technology trends, techniques, and test and measurement best practices for power, wireless, and high speed I/O. With the theme of “Accelerating Progress,” the 8+-hour free virtual global conference will from 14th June through to 29th June 2022, in eight global regions, including Europe, the Americas, China, Taiwan, India, ASEAN, Japan, and Korea.
The Fischer family founded Conextivity® Group to meet the connectivity challenge posed by the emergence of new cross-functional and scalable ecosystems, from locally interconnected devices and sensors to cloud-managed IoT platforms. The group's R&D department, which has doubled in size over the last five years, is strengthening its teams with new expertise, especially in signal integrity engineering, embedded electronics, the cloud and the IoT.
The growth of smart cities is prompting the rapid increase in the number of screens in our lives for applications in department stores, parking lots, checkouts, and elsewhere. To meet this increasing demand and the rollout of processing-intensive features like computer vision, NEXCOM brings two new models to the XPPC touchscreen computer range.
Intel today recognized the contributions of its Vietnam site to alleviating constraints in the global semiconductor supply chain. Innovative approach to substrate processing in Vietnam enabled millions of additional units amid supply constraints.