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Segula Technologies News

SEGULA TECHNOLOGIES SIGNS AN INTEGRATION AGREEMENT WITH CIDEIN TO ACCELERATE ITS COMMITMENT TO ELECTRONIC ENGINEERING AND EMBEDDED TECHNOLOGY

SEGULA Technologies and CIDEIN have joined forces to undertake a consolidation and development plan both in Spain and worldwide. Both companies announce the development of a printed circuit board design centre of excellence in Barcelona, which will be supported by SEGULA's network of offices to offer better proximity to national and international customers. CIDEIN, Spain's leader in component technology, printed circuit board design and electronic boards, has more than 18,000 references for high value-added projects. With this agreement, SEGULA Technologies plans to double its activity in Spain.

Toshiba News

TOSHIBA ANNOUNCES LOAD SWITCHES WITH ULTRA-LOW QUIESCENT CURRENT CONSUMPTION OF 0.08NA

Toshiba Electronics Europe GmbH (“Toshiba”) has launched three load switch products that deliver a remarkable decrease in quiescent current. The new devices are primarily intended for use in wearable and IoT applications where they will control the power supply for peripherals such as sensors.

PVL News

FANFIR TORRIX XTS SENSOR - THE ALL-ROUNDER FOR LEVEL MEASUREMENT IS NOW AVAILABLE FROM PVL

PVL, a leading distributor of industrial automation and safety components is pleased to announce the availability of the TORRIX XTS fill level sensor from Fanfir, market leading specialists in the development and manufacturing of sensors and systems for monitoring and measuring fill levels. the TORRIX XTS is maintenance free and does not require recalibration, minimising cost of ownership.

Exel Composites News

Exel Composites on ACCOMODATING 5G FREQUENCIES WITH COMPOSITES

While 5G technology is undoubtedly improving global connectivity capabilities, it has led to challenges for telecoms equipment manufacturers because of the demands imposed by its operation.For example, the frequencies used with 5G raise to much higher than with 4G and those signals cannot easily penetrate some materials and can be easily obstructed, which has led to signal attenuation issues.

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