Engineers are using miniaturized components and flexible or rigid-flex PCBs. However, a very strong trend is 3D packaging. Are you curious whether the chip carrier from HARTING also offers many advantages for your product?.
Reconfigurable intelligent surfaces (RIS) are drawing attention in the wireless industry due to their potential for an efficient 5G mmWave rollout as well as future 6G applications.
The new product provides double the capacity of 16Gb modules within the same package size, enabling 128GB DRAM module production without the TSV process, and decreasing power consumption by 10%.
Conta-Clip introduces the new, inverse and modular KDSI-SR cable entry system for reliable sealing, maximum flexibility and time saving feed-through of cables with and without plugs.
Sivers Semiconductors has received an initial order from Vector Photonics for the evaluation of epitaxial material for a new, next-generation surface coupling laser project.
Mouser Electronics partners with u-blox, a leading manufacturer of positioning and wireless communication technologies, to support design in automotive, industrial, and consumer applications.