19
'23
Written on
Toshiba News
19
'23
Written on
Infineon News
Flexibility meets increased power density and performance: Infineon extends 1200 V 62 mm IGBT7 portfolio with new maximum current rating
Infineon Technologies AG introduces a 62mm half-bridge and common emitter module portfolio with 1200 V TRENCHSTOP IGBT7 chips.
19
'23
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Tasking News
TASKING presents TriCore Qualified C Library for functional safety
The new C library simplifies development according to ISO 26262 while providing enhanced performance.
18
'23
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Powell Electronics News
Phoenix offers Blindmate RF contacts with widest axial mating tolerance from East Coast Microwave
Powell Electronics uses PkZ series blindmate RF contacts from Phoenix Company of Chicago for high-rel applications in defense, aerospace, and industrial sectors.
18
'23
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Lanner Electronics
Lanner and GoodVision Forge Partnership to Revolutionize Real-time Traffic Video Analytics Solutions
Lanner Electronics, a leading provider of intelligent edge computing solutions, is pleased to announce a strategic collaboration with GoodVision, a prominent provider of advanced video analytics technology.
18
'23
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Moxa News
Moxa focuses on large-scale industrial network deployments with modular managed switches
Moxa introduces the MDS-G4020-L3-4XGS series of Ethernet switches, offering versatile Layer 3 full Gigabit modular managed switches with four 10GbE + sixteen Gigabit ports, embedded ports, interface module expansion slots, and power module slots for industrial networks.
18
'23
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AMD News
AMD EPYC CPUs NOW POWER SAP APPLICATIONS HOSTED ON GOOGLE CLOUD
Critical SAP Business Suite workloads now run on AMD EPYC processor-powered Google Cloud N2D offering, delivering impressive performance and energy efficiency.
18
'23
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ANSYS News
ANSYS AND ALTIUM BOOST ELECTRONICS DESIGN WITH DIGITAL CONTINUITY
Ansys and Altium will further streamline electronics design and development with seamless integration between ECAD and simulation.
18
'23
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Samsung News
SAMSUNG STARTS MASS PRODUCTION OF AUTOMOTIVE UFS 3.1 MEMORY SOLUTION
The new UFS 3.1 is optimized for IVI systems and consumes 33% less energy, providing added benefits to future automotive applications.
17
'23
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Infineon News
