11 {{ "2021-10-11T00:00:00+00:00" | date "MMM" }} '21

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Rohde & Schwarz

Rohde & Schwarz Mobile Test Summit 2021 brings T&M experts together with global 5G leaders

Key industry names including Comprion, Deutsche Telekom, MediaTek, Nokia, Picocom, Qualcomm, and Viavi will complement the experts from Rohde & Schwarz at this year’s Mobile Test Summit. Organized by Rohde & Schwarz and reaching a global audience, the digital conference will provide a platform for knowledge, education and vision around the latest challenges and developments in 5G NR wireless communications.

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11 {{ "2021-10-11T00:00:00+00:00" | date "MMM" }} '21

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ESCHA News

Product Premieres at SPS 2021

At the SPS 2021 in Nuremberg, the German connectivity specialist ESCHA is giving an outlook on the coming trends and technologies that will shape the development of connectors in the coming years. The main focus will be on Single Pair Ethernet technology (SPE).

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11 {{ "2021-10-11T00:00:00+00:00" | date "MMM" }} '21

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HighTec News

Compiler Update for HighTec C/C++ Development Platform for Infineon AURIX TC4xx for Safety-relevant Applications

Faster build, advanced code optimization for AURIX MCUs, faster safety certification. HighTec EDV-Systeme GmbH presents a new version of the compiler of the HighTec C/C++ Development Platform for Infineon's AURIX TC4xx.

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11 {{ "2021-10-11T00:00:00+00:00" | date "MMM" }} '21

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Bulgin News

Bulgin’s New Rugged USB Type-C Connectors Further Extend the Scope of Application Possibilities Addressed

Bringing even greater breadth to its product portfolio, Bulgin has now expanded its popular Buccaneer range of robust connector solutions through the addition of USB Type-C 3.2 Gen 2x2 options.

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11 {{ "2021-10-11T00:00:00+00:00" | date "MMM" }} '21

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NEC Corporation News

NEC's 5G massive MIMO Open RAN radio units awarded TIP's "Requirements Compliant Ribbon"

NEC Corporation (NEC; TSE: 6701) announced today that its Open RAN 5G massive MIMO (*) radio units have been awarded a Telecom Infra Project (TIP) Requirements Compliant Ribbon, and are listed on new windowTIP Exchange.

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11 {{ "2021-10-11T00:00:00+00:00" | date "MMM" }} '21

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IDS Imaging Development Systems GmbH

Evolution in the press shop

Intelligent, camera-based tool protection in stamping and forming technology

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11 {{ "2021-10-11T00:00:00+00:00" | date "MMM" }} '21

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Mouser News

Mouser Electronics and Texas Instruments Present Functional Safety Webinar

Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, has teamed up with Texas Instruments to bring the engineering community a brand new webinar, titled “Develop your functional safety signal chain application with Texas Instruments”. The free live webinar will occur at 3 p.m. CEST on Monday, 18 October 2021.

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09 {{ "2021-10-09T00:00:00+00:00" | date "MMM" }} '21

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Rohm Semiconductors News

ROHM’S 75W HIGH OPTICAL OUTPUT LASER DIODE FOR LIDAR

High density emission along with the industry’s narrowest width supports longer distances and higher accuracy in LiDAR-equipped applications.

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09 {{ "2021-10-09T00:00:00+00:00" | date "MMM" }} '21

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TDK News

PRESSURE SENSORS: TDK OFFERS MINIATURIZED, HIGHLY SENSITIVE MEMS PRESSURE SENSOR ELEMENT

TDK Corporation (TSE:6762) presents the new C35 type pressure sensor element, designed to measure a range of 0 to 100 mbar. It combines high sensitivity with extremely low dimensions of just 2.05 x 2.05 x 1.2 mm, enabling compact pressure sensor designs.

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08 {{ "2021-10-08T00:00:00+00:00" | date "MMM" }} '21

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Phoenix Contact News

PCB terminal blocks for PROFINET

Phoenix Contact is extending its portfolio with PCB terminal blocks for PROFINET-compliant data transmission.

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At the SPS 2021 in Nuremberg, the German connectivity specialist ESCHA is giving an outlook on the coming trends and technologies that will shape the development of connectors in the coming years. The main focus will be on Single Pair Ethernet technology (SPE).

Faster build, advanced code optimization for AURIX MCUs, faster safety certification. HighTec EDV-Systeme GmbH presents a new version of the compiler of the HighTec C/C++ Development Platform for Infineon's AURIX TC4xx.

Bringing even greater breadth to its product portfolio, Bulgin has now expanded its popular Buccaneer range of robust connector solutions through the addition of USB Type-C 3.2 Gen 2x2 options.

NEC Corporation (NEC; TSE: 6701) announced today that its Open RAN 5G massive MIMO (*) radio units have been awarded a Telecom Infra Project (TIP) Requirements Compliant Ribbon, and are listed on new windowTIP Exchange.

Intelligent, camera-based tool protection in stamping and forming technology

High density emission along with the industry’s narrowest width supports longer distances and higher accuracy in LiDAR-equipped applications.

TDK Corporation (TSE:6762) presents the new C35 type pressure sensor element, designed to measure a range of 0 to 100 mbar. It combines high sensitivity with extremely low dimensions of just 2.05 x 2.05 x 1.2 mm, enabling compact pressure sensor designs.

Phoenix Contact is extending its portfolio with PCB terminal blocks for PROFINET-compliant data transmission.

International