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Interactanalysis News

Global manufacturing industry output to hit $41.9 Tn in 2021, up from $39.3 Tn in 2020 

Market intelligence firm Interact Analysis has released the latest update of the global Manufacturing Industry Output Tracker (MIO). The research shows that recovery in 2021 will be muted, following a far smaller contraction in 2020 than had initially been predicted.

Sivers Semiconductors News

Sivers Semiconductors to develop CW-WDM MSA compliant DFB laser arrays

Sivers Semiconductors AB today announced that its subsidiary, Sivers Photonics, will develop CW-WDM MSA compliant laser arrays that support Ayar Labs’ optical I/O solution. Ayar Labs is the leader in integrated optical I/O and is pushing the boundaries for AI, cloud, high-performance computing, 5G, and LIDAR.

Microsys News

MicroSys Partners with Leading AI Chipmaker Hailo to Launch High-Performance, Embedded AI Platform

MicroSys miriac embedded modules and platforms combined with Hailo-8 AI acceleration modules offer a high-performance, scalable embedded platform for AI processing at the edge, with applications in fields such as Industry 4.0, automotive and heavy machinery.

Binder News

Simplify safe signal transmission in sensor-actuator applications

Field-wireable M8 signal cable connectors from binder support efficient and reliable installations in sensor and actuator applications. Featuring snap-in quick locking and now offered with 3 to 6 pins, they prove themselves in industrial applications that require reliable signal transmission and are subject to installation space constraints.

Lane Electronics News

Wide Range of Positronic industry standard D-Sub high reliability connectors for Military, Aerospace and Industrial applications available from Lane Electronics

Lane Electronics, a leading franchised distributor for many of the industry’s major electrical and electronic connector manufacturers, is an authorised distributor for Positronic, a market leading manufacturer of high reliability signal and power connectors providing mission critical performance.

CEVA News

CEVA, Beken and VisiSonics Announce Reference Design for 3D Spatial Audio in Headsets and TWS Earbuds

Companies collaborate to bring complete 3D spatial audio hardware and software solution to consumer electronics OEMs and ODMs. CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, together Beken Corporation, a key player in wireless communication solutions, and VisiSonics, the technology leader in 3D spatial audio technologies, today announced the availability of a complete 3D audio reference design for the rapid deployment of headsets and True Wireless Stereo (TWS) earbuds supporting spatial audio for use in gaming, multimedia and conferencing.

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