Bright, colourful, and highly consistent image reproduction. Display solutions and embedded systems provider, Review Display Systems (RDS) has announced the introduction of a new 13.3-inch TFT display module from industrial display manufacturer Tianma.
Flex Power Modules announces it is now a Member of the Xilinx Partner Program, giving customers easier access to both companies’ design tools and support when developing power systems for use with Xilinx’s market leading FPGAs and adaptive SoCs.
Basler is significantly expanding its presence in the CoaXPress 2.0 market and extending its product portfolio with additional CXP-12 camera models from the boost series, two new multi-channel CXP-12 interface cards, and a variety of matching components. The boost camera is now available with two ports and the powerful Sony Pregius S sensors IMX530, IMX531 and IMX532, with resolutions up to 24 MP and frame rates up to 150 fps.
A fully integrated charger solution combines USB PD, PPS, PowiGaN and FluxLink to maximize efficiency and slash component count in adapters and chargers.
Sivers Semiconductors AB today announced the launch of the new highly integrated, state-of-art 5G NR Radio Frequency Integrated Circuits (RFICs), TRB02801 and TRB03901, together with very high-powered RFIC and antenna RF modules, BFM02801 and BFM03901, covering all licensed 5G mmWave bands.
Industry-leading power density, new architectures and integration can reduce total cost of ownership, helping engineers solve enterprise-server design challenges.
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has developed a model-based development (MBD) simulation technology that shortens verification times for automotive semiconductors by about 90 percent.