Infineon Technologies AG and Fingerprint Cards AB (STO: FING B, Fingerprints) today announced the signing of a joint development and commercialization agreement of a plug-and-play turnkey solution for biometric payment smart cards. The goal of the cooperation is to make biometric smart card production as simple and easy as producing a standard dual interface payment card.
ST has introduced LSM6DSV16X, the flagship 6-axis inertial measurement unit (IMU) embedding ST’s Sensor Fusion Low Power (SFLP) technology, Artificial Intelligence (AI), and adaptive-self-configuration (ASC) for superior power optimization.
High-frequency crystal oscillators from Hong Kong X'tals (HKC) ensure high stability and low noise in the system design. This is possible thanks to a differential output and low-phase jitter.
Leveraging proprietary PCB electrical and mechanical design topologies, Murata has introduced a new series of compact DC-DC converters that are aligned with the increasing prevalence of wide bandgap technology. The new MGN1 series of 1W output DC-DC converters are designed to deliver the voltages needed by the gate drivers of GaN devices.
Electric vehicles contain many electronic components that emit radio-frequency interference which may have a negative impact on the vehicle performance and driving experience. To ease and speed up the development process, AVL and Rohde & Schwarz, two of the world’s leading providers of automotive test systems, present an innovative solution for automated electromagnetic compatibility (EMC) data analysis of an electric drivetrain under real driving conditions.
Infineon Technologies AG recently added EasyPACK 4B to its industry-leading Easy power module family. The lead-type of the new family targets applications in photovoltaic string inverters.
Diodes Incorporated (Diodes) is introducing its latest PCIe® 3.0 packet switch, the DIODES PI7C9X3G1224GP. A high-performance 12-port, 24-lane device, it can be used in edge computing, data storage, communications infrastructure, and incorporated into host bus adaptors (HBAs), industrial controllers, and network routers.
ROHM has signed a joint development agreement with Mazda Motor Corporation (Mazda) and Imasen Electric Industrial Co., Ltd., (Imasen) for inverters and SiC power modules to be used in the electric drive units of electric vehicles, including e-Axle.
Rutronik System Solutions expands the existing product portfolio with the new Adapter Board, RAB2 for CO2 Sensing. The board offers a unique approach using CO2 sensors, comparing two ultra-modern sensors from Infineon and Sensirion. That provides the opportunity to use one board in the pre-development phase to evaluate which sensor suits a specific application most.