onsemi, a leader in intelligent power and sensing technologies, will showcase its latest image sensing technology at VISION – the world’s leading trade fair for machine vision – at booth 10G30.
Telit, a global leader in the Internet of Things (IoT), today announces it is broadening its connectivity offering by adding a leading service provider’s local native IoT profile to its eUICC-compliant NExTPlus SIM. This allows IoT customers to overcome permanent roaming restrictions by zero-touch switching between the Telit network, NExT, and local MNO profiles from a single SIM.
Panasonic Industry Europe has extended its range of Bluetooth® LE modules with the launch of the PAN1782, which targets cost-effective applications that still require high performance, including professional lighting, asset tracking, smart home, advanced wearables, and higher value IoT applications.
Tektronix, Inc., a leading global equipment and software manufacturer delivering innovative, precise and easy-to-operate test, measurement and monitoring solutions, has today announced its participation at this year’s electronica 2022 exhibition, taking place in Munich from November 15-18.
First-of-its-kind system enables a new class of solid-state thermal management systems that is currently only possible with bulkier, mechanical alternatives.
Rohde & Schwarz is adding a completely new series to its oscilloscope portfolio that delivers a number of industry firsts. The new R&S MXO 4 series oscilloscopes feature the world’s fastest real-time update rate of over 4.5 million acquisitions per second. Development engineers can now see more signal detail and infrequent events than with any other oscilloscope.
Diodes Incorporated today announced the latest addition to its broad portfolio of ReDrivers with the release of a 1.8V low-power, 4 data lanes 2.5Gbps ReDriver.
Siemens Digital Industries Software today introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.
Rutronik System Solutions' board family gets a new addition with the RAB1 - Sensorfusion. The adapter board offers its own platform that allows machine learning (ML) based sensor fusion, which forms the basis and the future of artificial intelligence (AI). Equipped with the highest performance sensors from Infineon, Bosch SE, and Sensirion.