05 {{ "2022-09-05T00:00:00+00:00" | date "MMM" }} '22

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Nowi Energy News

Telink Introduces Energy Harvesting Multi-protocol Wireless Connectivity Module, Powered by Nowi, to Enable Batteryless Solutions

Telink and Nowi reinforce their existing partnership by launching an Energy Autonomous Wireless Connectivity Module. This new product offering enables additional energy harvesting use-cases by further reducing bill of material size, cost and complexity.

Read more…

05 {{ "2022-09-05T00:00:00+00:00" | date "MMM" }} '22

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Innoscience News

Innoscience’s Bi-GaN bi-directional GaN HEMTs used inside smartphones save space, increase efficiency and lower temperature rise

OPPO announces world's first cell phones with inbuilt GaN charging protection.

Read more…

03 {{ "2022-09-03T00:00:00+00:00" | date "MMM" }} '22

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Codasip News

Codasip joins Intel Pathfinder for RISC-V program

Codasip, the leader in processor design automation and RISC-V processor IP, today announced that it would make its 32-bit L31 core available through the Professional Edition of the Intel^® Pathfinder for RISC-V* program.

Read more…

02 {{ "2022-09-02T00:00:00+00:00" | date "MMM" }} '22

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Summa Networks News

SUMMA NETWORKS JOINS RURAL WIRELESS ASSOCIATION (RWA)

Summa Networks today announced it has joined the Rural Wireless Association (RWA). Summa Networks is the market specialist in Subscribers, Policy and Identity Management. Its solution is a complete software suite to guide carriers in their transition to 5G, including UDM/UDR/AUSF/UDSF and PCF for 5G SA as well as HLR/HSS/AAA/EIR/PCRF for 2G, 3G, 4G, 5G NSA networks, while ensuring their interworking in a single product.

Read more…

02 {{ "2022-09-02T00:00:00+00:00" | date "MMM" }} '22

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Bender News

NEW, DIVISIBLE MEASURING CURRENT TRANSFORMERS FOR EXISTING ELECTRICAL INSTALLATIONS

Bender has added new measuring current transformers to its portfolio that are specifically intended for use in existing electrical installations.

Read more…

01 {{ "2022-09-01T00:00:00+00:00" | date "MMM" }} '22

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NEC Corporation News

Virgin Media O2, NEC and Rakuten Symphony drive multi-vendor Open RAN innovation in the UK

Virgin Media O2, NEC Corporation and Rakuten Symphony have announced their joint multi-vendor Open RAN deployment is entering the field phase, commencing with the activation of the first live sites in Virgin Media O2's commercial network.

Read more…

01 {{ "2022-09-01T00:00:00+00:00" | date "MMM" }} '22

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TDK News

Inductors: New advanced multilayer inductors from TDK meet evolving automotive PoC demands

TDK Corporation has announced the introduction of the new MLJ1608WG Series of multilayer inductors. These compact components are targeted at use in automotive Power over Coax (PoC) implementations. Mass production began in August 2022.

Read more…

01 {{ "2022-09-01T00:00:00+00:00" | date "MMM" }} '22

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Toshiba News

TOSHIBA LAUNCHES THIRD GENERATION 650V SILICON CARBIDE (SIC) MOSFETS

Toshiba Electronics Europe GmbH (“Toshiba”) has launched a total of five new third-generation 650V silicon carbide (SiC) MOSFET devices for industrial equipment.

Read more…

29 {{ "2022-08-29T00:00:00+00:00" | date "MMM" }} '22

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Toshiba News

Toshiba Releases Stepping Motor Driver IC That Contributes to Saving Space on Circuit Boards

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has expanded its lineup of stepping motor driver ICs with the launch of “TB67S549FTG,” a stepping motor driver IC housed in a small package, with built-in constant-current control that does not require external circuit components.

Read more…

26 {{ "2022-08-26T00:00:00+00:00" | date "MMM" }} '22

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Kontron News

Invitation to a personal meeting at InnoTrans 2022

Kontron Transportation, international leader in end-to-end communication solutions for mission-critical networks, and its sister company Kontron Europe, the world's leading provider of IoT and embedded computer technology, will be presenting a wide range of innovative solutions at InnoTrans, the world's leading international trade fair, from September 20-23, 2022. We hereby cordially invite you to visit us at the trade fair in Berlin.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Telink Introduces Energy Harvesting Multi-protocol Wireless Connectivity Module, Powered by Nowi, to Enable Batteryless Solutions

Telink and Nowi reinforce their existing partnership by launching an Energy Autonomous Wireless Connectivity Module. This new product offering enables additional energy harvesting use-cases by further reducing bill of material size, cost and complexity.

Innoscience’s Bi-GaN bi-directional GaN HEMTs used inside smartphones save space, increase efficiency and lower temperature rise

OPPO announces world's first cell phones with inbuilt GaN charging protection.

Codasip joins Intel Pathfinder for RISC-V program

Codasip, the leader in processor design automation and RISC-V processor IP, today announced that it would make its 32-bit L31 core available through the Professional Edition of the Intel^® Pathfinder for RISC-V* program.

SUMMA NETWORKS JOINS RURAL WIRELESS ASSOCIATION (RWA)

NEW, DIVISIBLE MEASURING CURRENT TRANSFORMERS FOR EXISTING ELECTRICAL INSTALLATIONS

Bender has added new measuring current transformers to its portfolio that are specifically intended for use in existing electrical installations.

Virgin Media O2, NEC and Rakuten Symphony drive multi-vendor Open RAN innovation in the UK

Virgin Media O2, NEC Corporation and Rakuten Symphony have announced their joint multi-vendor Open RAN deployment is entering the field phase, commencing with the activation of the first live sites in Virgin Media O2's commercial network.

Inductors: New advanced multilayer inductors from TDK meet evolving automotive PoC demands

TDK Corporation has announced the introduction of the new MLJ1608WG Series of multilayer inductors. These compact components are targeted at use in automotive Power over Coax (PoC) implementations. Mass production began in August 2022.

TOSHIBA LAUNCHES THIRD GENERATION 650V SILICON CARBIDE (SIC) MOSFETS

Toshiba Electronics Europe GmbH (“Toshiba”) has launched a total of five new third-generation 650V silicon carbide (SiC) MOSFET devices for industrial equipment.

Toshiba Releases Stepping Motor Driver IC That Contributes to Saving Space on Circuit Boards

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has expanded its lineup of stepping motor driver ICs with the launch of “TB67S549FTG,” a stepping motor driver IC housed in a small package, with built-in constant-current control that does not require external circuit components.

Invitation to a personal meeting at InnoTrans 2022

International

Market Overview

Technical Articles

Case studies

Telink and Nowi reinforce their existing partnership by launching an Energy Autonomous Wireless Connectivity Module. This new product offering enables additional energy harvesting use-cases by further reducing bill of material size, cost and complexity.

OPPO announces world's first cell phones with inbuilt GaN charging protection.

Codasip, the leader in processor design automation and RISC-V processor IP, today announced that it would make its 32-bit L31 core available through the Professional Edition of the Intel® Pathfinder for RISC-V* program.

Bender has added new measuring current transformers to its portfolio that are specifically intended for use in existing electrical installations.

Virgin Media O2, NEC Corporation and Rakuten Symphony have announced their joint multi-vendor Open RAN deployment is entering the field phase, commencing with the activation of the first live sites in Virgin Media O2's commercial network.

TDK Corporation has announced the introduction of the new MLJ1608WG Series of multilayer inductors. These compact components are targeted at use in automotive Power over Coax (PoC) implementations. Mass production began in August 2022.

Toshiba Electronics Europe GmbH (“Toshiba”) has launched a total of five new third-generation 650V silicon carbide (SiC) MOSFET devices for industrial equipment.

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has expanded its lineup of stepping motor driver ICs with the launch of “TB67S549FTG,” a stepping motor driver IC housed in a small package, with built-in constant-current control that does not require external circuit components.

International

Codasip, the leader in processor design automation and RISC-V processor IP, today announced that it would make its 32-bit L31 core available through the Professional Edition of the Intel^® Pathfinder for RISC-V* program.