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FOBA News

FOBA Upgrades Portfolio with New Fiber Laser Marking System

FOBA Laser Marking + Engraving, a global leader in industrial laser part marking and engraving solutions, has introduced another laser marker for line integration: The new FOBA Y.0200-S model is an upgrade to the existing range of fiber laser marking systems. The powerful marking laser is characterized by its compact design and gives manufacturers a high amount of marking and mounting versatility.

Elesa + Ganter News

Indexing plungers with position signal

Indexing plungers very often fulfill safety functions – but this is not the only time when it is important to obtain feedback about their position. With the new series GN 817.6, Elesa+Ganter now also allows automated status checks.

Rohde & Schwarz

Rohde & Schwarz and MediaTek verify dynamic spectrum sharing (DSS) for 5G NR

Today, frequencies below 6 GHz are heavily utilized due to the successful deployment of 4G LTE. This creates a challenge for network operators worldwide on how to deploy 5G NR at these low frequency bands. Dynamic spectrum sharing (DSS) is a technique that enables mobile network operators to use LTE and 5G NR in the same frequency band. The in-depth validation of the standardized coexistence methodology is key to the success of this technology. Rohde & Schwarz and MediaTek have leveraged their unique expertises through a collaboration, with the resulting verification that uses the R&S CMX500 5G NR radio communication tester platform by Rohde & Schwarz and a device under test (DUT) provided by MediaTek.

TDK News

New Data Book for aluminum electrolytic capacitors

TDK Corporation presents the fully revised Data Book for aluminum electrolytic capacitors with screw terminal, snap-in, axial and single-ended design.

Stemmer imaging News

Easy 3D Plug & Play with Zivid One+

STEMMER IMAGING has extended its portfolio with the Zivid One+ 3D colour cameras from the Norwegian supplier Zivid since summer 2019. Our product manager Tim Huylebrouck describes his first experience with the 3D cameras.

Kontron News

COM-HPC™ - Higher performance for Computer-on-Modules

Peter Müller, Vice President Product Center Modules at Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), comments on the background to the development of the new Computer-On-Module standard COM-HPC™:

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