01 {{ "2021-03-01T00:00:00+00:00" | date "MMM" }} '21

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Anritsu News

Anritsu launches new modules to make production line testing more efficient

Anritsu Corporation is pleased to announce the simultaneous launch of its TRX Test Module MU887002A, designed to improve the efficiency of production-line inspection of wireless communications devices, including 5G, and its space-saving Universal Wireless Test Set MT8872A.

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01 {{ "2021-03-01T00:00:00+00:00" | date "MMM" }} '21

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Infineon News

Infineon introduces AIROC Wi-Fi 6/6E and Bluetooth^® 5.2 combo family for IoT and streaming devices

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its wireless portfolio of high-performance, reliable and secure offerings.

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01 {{ "2021-03-01T00:00:00+00:00" | date "MMM" }} '21

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ONSEMI News

ON Semiconductor Is Going Virtual for embedded world 2021 DIGITAL

The online format for embedded world 2021 will enable ON Semiconductor to give engineers an unparalleled visitor experience.

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01 {{ "2021-03-01T00:00:00+00:00" | date "MMM" }} '21

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IAR Systems News

IAR Systems adds Functional Safety certification for build tools for Linux

Streamlines Continuous Integration workflows from development to building and testing of applications with demands for Functional Safety certification.

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01 {{ "2021-03-01T00:00:00+00:00" | date "MMM" }} '21

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Continental News

Start of Production in Debrecen, Hungary: Vitesco Technologies Further Expands Global Presence

After just two years of construction, the newest Vitesco Technologies plant in Debrecen, Hungary, went now into operation.

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01 {{ "2021-03-01T00:00:00+00:00" | date "MMM" }} '21

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TDK News

Service: TDK offers a comprehensive calculation tool for aluminum electrolytic capacitors

TDK Corporation (TSE:6762) presents the fully revised version 4.0 of the tried and tested Online AlCap Useful Life Calculation Tool for EPCOS aluminum electrolytic capacitors.

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26 {{ "2021-02-26T00:00:00+00:00" | date "MMM" }} '21

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Rohm Semiconductors News

ROHM’s Wi-SUN FAN Module Solution: Empowering the infrastructure of smart cities

ROHM has developed a new Wi-SUN FAN (Field Area Network) module for infrastructure applications, capable of connecting up to 1,000 nodes in a mesh network.

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26 {{ "2021-02-26T00:00:00+00:00" | date "MMM" }} '21

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TDK News

TDK expands embedded motor controller family to target high temperature environments

TDK Corporation (TSE 6762) has expanded its Micronas embedded motor controller portfolio to address higher temperature applications. The HVC 4222F and HVC 4422F were developed for operating smart actuators in applications with ambient temperature requirements up to 150 °C. HVC 4222F offers 32k flash memory while the HVC 4422F comes with 64k flash for more complex software implementations. These high temperature devices target applications in combustion vehicle drive trains, and emerging thermal management systems in electric and hybrid vehicles.*

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26 {{ "2021-02-26T00:00:00+00:00" | date "MMM" }} '21

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Hexagon Manufacturing Intelligence News

Hexagon accelerates the inspection of delicate parts with new precision non-contact CMM sensor

Chromatic white-light sensor increases options for rapid non-contact scanning, helps electronics and medical manufacturers succeed with emerging technologies.

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26 {{ "2021-02-26T00:00:00+00:00" | date "MMM" }} '21

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ONSEMI News

How Ultra-Low-Power Sensor Solutions are Enabling Smart and Secure Connected Buildings

The infrastructure to support the Internet of Things (IoT) is now well established, extending far beyond the unseen legions of servers and data centers to reach right into our homes, offices and factories.

Read more…

Anritsu Corporation is pleased to announce the simultaneous launch of its TRX Test Module MU887002A, designed to improve the efficiency of production-line inspection of wireless communications devices, including 5G, and its space-saving Universal Wireless Test Set MT8872A.

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its wireless portfolio of high-performance, reliable and secure offerings.

The online format for embedded world 2021 will enable ON Semiconductor to give engineers an unparalleled visitor experience.

Streamlines Continuous Integration workflows from development to building and testing of applications with demands for Functional Safety certification.

After just two years of construction, the newest Vitesco Technologies plant in Debrecen, Hungary, went now into operation.

TDK Corporation (TSE:6762) presents the fully revised version 4.0 of the tried and tested Online AlCap Useful Life Calculation Tool for EPCOS aluminum electrolytic capacitors.

ROHM has developed a new Wi-SUN FAN (Field Area Network) module for infrastructure applications, capable of connecting up to 1,000 nodes in a mesh network.

Chromatic white-light sensor increases options for rapid non-contact scanning, helps electronics and medical manufacturers succeed with emerging technologies.

The infrastructure to support the Internet of Things (IoT) is now well established, extending far beyond the unseen legions of servers and data centers to reach right into our homes, offices and factories.

International