20
'21
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innodisk
18
'21
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ST News
STMICROELECTRONICS INTRODUCES FIRST POWERGAN PRODUCTS FOR MORE ENERGY-EFFICIENT, SLIMMER POWER SUPPLIES
Gallium Nitride (GaN)-based products deliver better energy efficiency and enable more compact designs of power supplies for a broad range of consumer, industrial, and automotive applications. First product from full portfolio of ST’s PowerGaN family in production now; additional devices in various packages and specification ratings coming soon.
18
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Fischer Elektronik News
EXTENSION OF THE PACKAGING OPTIONS FOR MALE HEADERS WITH A GRID PATTERN OF 1.27 MM (SLV W 3 / 4 / 5 SMD …)
The steadily increasing trend towards packaging forms suitable for automatic machines is unbroken. As a result the inquiries and orders for machine-compatible packaging for connectors in "tape & reel" packaging have increased significantly in recent months.
17
'21
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Rohde & Schwarz
Rohde & Schwarz brings back Demystifying EMC conference in 2022 as fully virtual event for a global audience
Now in its eighth year, the popular Demystifying EMC conference will be held in a virtual format in January 2022. It will build on the global reach it achieved in 2021, when participants from more than 60 countries joined the free industry event with its high-quality trainings and networking opportunities
17
'21
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Septentrio News
Should you build your own GNSS/INS?
5 Reasons why a pre-integrated GNSS/INS solution brings more value.
17
'21
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Renesas News
Renesas Launches Automotive Actuator and Sensor Control MCUs for Evolving Edge Applications in Next-Generation E/E Architecture
16-Bit RL78/F24 and RL78/F23 Deliver Enhanced Security, Connectivity, and Functional Safety Capabilities.
17
'21
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IAR Systems News
Secure Thingz and Intrinsic ID partner to ensure supply chains of trust for the embedded industry
Partnership to enable rapid development, implementation, and provisioning of unique and secure identity for IoT applications.
17
'21
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Recabuk News
11th Gen processors bolster embedded vision systems
New COMs based on latest Intel Core processors bring benefits to demanding IoT, edge and vision applications.
17
'21
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CEA Leti News
HfO2-Based FeRAM Arrays Designed & Fabricated at CEA-Leti Bring the Technology Closer to Manufacturability
Unlike PZT-Based Ferroelectric Memories, These Devices Are Fully Compatible With CMOS Processes, Scalable to Advanced Nodes and Lead-Free.
17
'21
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Infineon News
