Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, announces its redesigned Technical Resource Centre, which contains the global distributor’s ever-expanding collection of technical articles, blogs, eBooks, and Methods technology and solutions journal, plus related product information, in a searchable repository.
As wireless network operators roll out 5G NR in the millimeter wave spectrum, it is critical to ensure continued reliability of E911 calls and accurate determination of location in mobile devices.
PICMG, a leading consortium for the development of open embedded computing specifications, announces the ratification of the MicroSAM specification. MicroSAM is a new microcontroller-agnostic, ultra-small form-factor module for the enablement of smart sensors.
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the CC3230S/CC3230SF SimpleLink Wi-Fi® wireless microcontrollers (MCUs) from Texas Instruments.
STMicroelectronics is pioneering the HMI of things with a new STM32* Nucleo display shield that leverages the affordability of STM32G0 microcontrollers (MCUs). The new X-NUCLEO- GFX01M1 SPI shield is supported in the latest TouchGFX software, version 4.15.0, which introduces additional new features including support for low-cost non-memory-mapped SPI Flash ICs.
MAX25430 slashes design size up to 40 percent and eliminates microcontrollers, metal enclosures and heat sinks for 25 percent lower cost than competitive solutions.
TDK Corporation (TSE 6762) announces the addition of models with an integral fan and enclosure to the 600W rated TDK-Lambda brand CUS600M series of AC-DC power supplies.
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announces the launch of the LaSAR Alliance (Laser Scanning for Augmented Reality), an ecosystem of leading technology developers, suppliers and manufacturers collaborating to develop and accelerate Augmented Reality (AR) smart-glass solutions. Founding members in the LaSAR Alliance include Applied Materials, Dispelix, Mega1, and Osram, in addition to ST.
The Ensenso N-Series is a compact and robust 3D camera system designed specifically for 3D applications in robotics and automated series production. Thanks to IP65/67 protection, it is also well-suited for use in harsher environments. The camera family is now being expanded by the new N40 and N45 models. They feature a novel design both inside and outside. Lightweight and with rounded edges, they open up new application possibilities, for example in collaborative robotics.