14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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Cadence News

Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs

Collaboration enables mutual customers to easily adopt the integrated Cadence digital full flow, which offers leading implementation and signoff technology for ultra-low power designs.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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Congatec News

NEW ULTRA-RUGGED 11TH GEN INTEL^® CORE^® CONGATEC MODULES WITH SOLDERED RAM

Congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel^® Core^® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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LEMO

Standard self-latching multipole connectors with alignment key

The LEMO B Series offers a modular, ergonomic, rugged and reliable circular multipole connector for applications needing quick and secure Push-Pull latching. Making it an ideal choice for test and measurement, instrumentation, medical devices, research and audio/video applications.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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CUI devices News

60 W Power-Only USB Type C Receptacle Features Vertical Orientation

CUI Devices’ Interconnect Group announced the continued expansion of their power-only USB Type C receptacle line with the introduction of a vertically-oriented model.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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MIkroe News

MIKROE’s universal FUSION development board for all Microchip PIC microcontrollers ‘equipped with everything developers need’

FUSION for PIC v8 includes Wi-Fi debugging, Click peripheral sockets, SiBRAIN MCU sockets plus display options.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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NEC Corporation News

Microsoft and NEC Expand Strategic Partnership to Boost Business Resiliency and Growth

Microsoft Corp. (Microsoft) and NEC Corporation (NEC; TSE: 6701) on Tuesday announced an expansion of their decades-long collaboration.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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Anritsu News

Supporting 6 GHz Frequency Band Measurements for Wireless communication device Production Lines

MT8870A/MT8872A supports IEEE 802.11ax and NR-U 6 GHz band.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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Keysight technologies News

Keysight’s Test Solutions Selected by DEKRA to Verify 5G, Wi-Fi and Bluetooth Devices in Compliance to Regulatory Standards

Global test house expands use of Keysight’s test platforms to address growing adoption of 5G and IoT.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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Telit News

Telit FN980 Certified for Use on T-Mobile’s 5G Network

Businesses and original equipment manufacturers (OEMs) are now able to leverage the FN980 for high-performance, bandwidth-intensive applications on T-Mobile’s 5G network.

Read more…

13 {{ "2021-07-13T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-13T00:00:00+00:00" | date "longDate" }}

FAULHABER GROUP

CELL ANALYSIS WITH PRECISION

Which medication can defeat cancer? What dose achieves the desired result without side effects? Above what limit does the beneficial medication turn toxic? Today, such questions are answered in test series with cell cultures. They are among the most important methods in medical research.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs

Collaboration enables mutual customers to easily adopt the integrated Cadence digital full flow, which offers leading implementation and signoff technology for ultra-low power designs.

NEW ULTRA-RUGGED 11TH GEN INTEL^® CORE^® CONGATEC MODULES WITH SOLDERED RAM

Congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel^® Core^® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.

Standard self-latching multipole connectors with alignment key

The LEMO B Series offers a modular, ergonomic, rugged and reliable circular multipole connector for applications needing quick and secure Push-Pull latching. Making it an ideal choice for test and measurement, instrumentation, medical devices, research and audio/video applications.

60 W Power-Only USB Type C Receptacle Features Vertical Orientation

CUI Devices’ Interconnect Group announced the continued expansion of their power-only USB Type C receptacle line with the introduction of a vertically-oriented model.

MIKROE’s universal FUSION development board for all Microchip PIC microcontrollers ‘equipped with everything developers need’

FUSION for PIC v8 includes Wi-Fi debugging, Click peripheral sockets, SiBRAIN MCU sockets plus display options.

Microsoft and NEC Expand Strategic Partnership to Boost Business Resiliency and Growth

Microsoft Corp. (Microsoft) and NEC Corporation (NEC; TSE: 6701) on Tuesday announced an expansion of their decades-long collaboration.

Supporting 6 GHz Frequency Band Measurements for Wireless communication device Production Lines

MT8870A/MT8872A supports IEEE 802.11ax and NR-U 6 GHz band.

Keysight’s Test Solutions Selected by DEKRA to Verify 5G, Wi-Fi and Bluetooth Devices in Compliance to Regulatory Standards

Global test house expands use of Keysight’s test platforms to address growing adoption of 5G and IoT.

Telit FN980 Certified for Use on T-Mobile’s 5G Network

Businesses and original equipment manufacturers (OEMs) are now able to leverage the FN980 for high-performance, bandwidth-intensive applications on T-Mobile’s 5G network.

CELL ANALYSIS WITH PRECISION

Which medication can defeat cancer? What dose achieves the desired result without side effects? Above what limit does the beneficial medication turn toxic? Today, such questions are answered in test series with cell cultures. They are among the most important methods in medical research.

International

Market Overview

Technical Articles

Case studies

Collaboration enables mutual customers to easily adopt the integrated Cadence digital full flow, which offers leading implementation and signoff technology for ultra-low power designs.

Congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.

The LEMO B Series offers a modular, ergonomic, rugged and reliable circular multipole connector for applications needing quick and secure Push-Pull latching. Making it an ideal choice for test and measurement, instrumentation, medical devices, research and audio/video applications.

CUI Devices’ Interconnect Group announced the continued expansion of their power-only USB Type C receptacle line with the introduction of a vertically-oriented model.

FUSION for PIC v8 includes Wi-Fi debugging, Click peripheral sockets, SiBRAIN MCU sockets plus display options.

Microsoft Corp. (Microsoft) and NEC Corporation (NEC; TSE: 6701) on Tuesday announced an expansion of their decades-long collaboration.

MT8870A/MT8872A supports IEEE 802.11ax and NR-U 6 GHz band.

Global test house expands use of Keysight’s test platforms to address growing adoption of 5G and IoT.

Businesses and original equipment manufacturers (OEMs) are now able to leverage the FN980 for high-performance, bandwidth-intensive applications on T-Mobile’s 5G network.

Which medication can defeat cancer? What dose achieves the desired result without side effects? Above what limit does the beneficial medication turn toxic? Today, such questions are answered in test series with cell cultures. They are among the most important methods in medical research.

International

Congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel^® Core^® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.