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Rohde & Schwarz

Rohde & Schwarz showcases the new R&S CMP180 next-generation wireless device R&D and production test platform

At Mobile World Congress, Rohde & Schwarz offers an exclusive preview of the new R&S CMP180 radio communication test platform. The single-box tester features parallel testing on up to 16 devices. It fulfills cellular and non-cellular multi-signal, multi-technology requirements, making it ideal for mass production environments. In Barcelona, Rohde & Schwarz demonstrates Wi-Fi 6E/Wi-Fi 7 testing with the R&S CMP180.

Maxim integrated News

Maxim Integrated's Infrared-Based Dynamic Gesture Sensor Detects a Broader Range of Hand Gestures at Greater Distances, Ensuring Drivers' Eyes Remain on the Road

MAX25405 next-generation optical sensor recognizes a variety of gestures in a quarter of the size and at 10x lower cost than camera-based time-of-flight systems in next-generation automotive, industrial and consumer applications.

CEVA News

CEVA Expands Its Market-Leading Wireless Connectivity Portfolio with New Ultra-Wideband Platform IP

CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today unveiled RivieraWaves UWB, an extremely power-efficient ultra-wideband (UWB) turnkey MAC and PHY platform intellectual property (IP) compliant with the IEEE 802.15.4z standard and in accordance with the FiRa consortium specifications.

Cadence News

CADENCE ADVANCES RF DESIGN WITH THE LATEST AWR DESIGN ENVIRONMENT PLATFORM

AWR V16 advances heterogeneous technology development for 5G wireless and connected systems for automotive, radar systems and semiconductor technologies. Custom RF to mmWave IP developed with AWR software is now accessible across Cadence design platforms, delivering seamless solutions for wireless systems. Foundational advance in IC, package and PCB RF workflows accelerates design turnaround time to align with customers’ end-market delivery time schedules. Fully integrated FEA solver technologies deliver accurate multiphysics (EM and thermal) systems analysis with near-linear scalability and capacity

CONTA-CLIP News

Three-level terminals with push-in connection

CONTA-CLIP expands its terminal block range featuring push-in connection for 2.5 mm² cross sections, adding the new PIKD three-level initiator terminals and multi-wire terminals.

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