TE Connectivity (TE), a world leader in connectivity and sensors, is freeing up valuable space on printed circuit boards (PCBs) for design engineers with its new compact AMPMODU wire-to-board receptacles with crimp contacts and shrouded headers. With centerline distances of 2 mm, they occupy 38 percent less space on a PCB than connectors with a 2.54 mm [0.100”] centerline.
SCHUNK is entering a new era of toolholding: In September, delivery of the sensory hydraulic expansion toolholder iTENDO, the most sensitive toolholder on the market, will begin.
Rohde & Schwarz fulfills the certification entry criteria (CEC) for a greatly increased number of the Global Certification Forum's (GCF) work items (WI) and PCS Type Certification Review Board (PTCRB) requests for 5G FR1 RF conformance testing. Thanks to 572 new GCF validations and 215 new PTCRB validations for the R&S TS8980FTA 3A, the updated version of the leading RF test system R&S TS8980 can now perform a broad range of 5G device certification tests.
Applied Materials, Inc. today announced a new addition to its highly successful Centris® Sym3® etch product family that now enables chipmakers to precisely pattern and shape ever-smaller features in leading-edge memory and logic chips.
Quantum cryptographic communication technology allows for completely secure real-time transmission of genome analysis data and transfer of online expert panel data.