Silicon Labs announced the general availability of its new 22 nm Series 3 SoCs, featuring multi-core architecture and the world's first PSA Level 4 security to accelerate secure, feature-rich IoT and Matter deployments.
Infineon is collaborating with NVIDIA to drive the 800 VDC power architecture for AI data centers using SiC and GaN solutions, ensuring high efficiency, reliability, and serviceability to minimize downtime and carbon footprint.
The KGP Series delivers high capacitance, low ESR/ESL, and durable metal lead frames for miniaturised, sustainable, and high-frequency industrial, energy, and downhole applications.
SAMWHA’s YT series offers low ESR, high ripple resistance, and AEC-Q200 qualification, ensuring reliable performance up to +150 °C for automotive and industrial electronics.
By combining 12-disk stacking with MAMR innovation, Toshiba aims to target 40TB-class 3.5-inch hard drives by 2027, thereby enhancing density, durability, and efficiency for next-generation data centres.
Yamaha Robotics SMT Section has introduced enhanced software tools to accelerate new product introduction (NPI) using YSUP-PG, the program generator for the company’s surface-mounters and inspection systems.