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SIPLACE Platform Drives SMT Innovation at APEX EXPO
ASMPT SMT Solutions showcases new placement technology at APEX EXPO 2026, highlighting demand for high-performance SMT systems in AI and data center applications.
smt.asmpt.com
The highlight at the ASMPT booth: With a footprint of just 1.1 × 2.4 meters, the new SIPLACE V gives electronics manufacturing a decisive boost – not only in real performance, but also in quality, flexibility, and future readiness.
Image source: ASMPT
ASMPT SMT Solutions reported strong engagement at APEX EXPO 2026, with its newly launched SIPLACE V placement platform attracting significant interest from North American electronics manufacturers.
Rising demand in advanced electronics manufacturing
Industries such as AI infrastructure, high-performance computing, and data centers are driving demand for more advanced surface-mount technology (SMT) solutions. These applications require high precision, flexibility, and throughput to handle increasingly complex electronic assemblies.
Manufacturers are also seeking integrated solutions that combine hardware performance with data-driven production capabilities.
SIPLACE V placement platform
The SIPLACE V platform, introduced to the U.S. market at the event, is designed to deliver up to 30% performance improvement under real production conditions.
It supports a wide component range—from ultra-small components to large and complex parts—while maintaining process stability. The system is built with a modern architecture that enables high-speed data communication and supports machine-to-machine connectivity.
Its open platform design allows integration of automation, data analytics, and AI-driven optimisation, while maintaining compatibility with existing SMT systems.
DEK TQ XL printer
ASMPT also presented the DEK TQ XL solder paste printer, designed for large-format circuit boards. The system accommodates boards up to 850 × 610 mm and supports high-weight and warped substrates, enabling consistent printing across the entire surface.
This capability addresses growing requirements for oversized PCBs in advanced electronics applications.
Toward connected production
The company highlighted its integrated software portfolio, which connects machines and processes into a unified production network. This approach supports real-time monitoring, optimisation, and data-driven decision-making across SMT lines.
Growth in North America
The strong response at the exhibition reflects increasing investment in electronics manufacturing across North America. Demand is particularly strong in sectors linked to AI and data center expansion.
In response, ASMPT is expanding its service organisation in the United States to provide enhanced technical support and local expertise.
Enabling next-generation SMT production
With the introduction of the SIPLACE V platform and complementary solutions, ASMPT is addressing the evolving requirements of high-performance electronics manufacturing. The combination of advanced hardware, integrated software, and local support strengthens its position in a rapidly growing market.
Edited by an industrial journalist, Lekshman Ramdas, with AI assistance.
www.asmpt.com
Image source: ASMPT
ASMPT SMT Solutions reported strong engagement at APEX EXPO 2026, with its newly launched SIPLACE V placement platform attracting significant interest from North American electronics manufacturers.
Rising demand in advanced electronics manufacturing
Industries such as AI infrastructure, high-performance computing, and data centers are driving demand for more advanced surface-mount technology (SMT) solutions. These applications require high precision, flexibility, and throughput to handle increasingly complex electronic assemblies.
Manufacturers are also seeking integrated solutions that combine hardware performance with data-driven production capabilities.
SIPLACE V placement platform
The SIPLACE V platform, introduced to the U.S. market at the event, is designed to deliver up to 30% performance improvement under real production conditions.
It supports a wide component range—from ultra-small components to large and complex parts—while maintaining process stability. The system is built with a modern architecture that enables high-speed data communication and supports machine-to-machine connectivity.
Its open platform design allows integration of automation, data analytics, and AI-driven optimisation, while maintaining compatibility with existing SMT systems.
DEK TQ XL printer
ASMPT also presented the DEK TQ XL solder paste printer, designed for large-format circuit boards. The system accommodates boards up to 850 × 610 mm and supports high-weight and warped substrates, enabling consistent printing across the entire surface.
This capability addresses growing requirements for oversized PCBs in advanced electronics applications.
Toward connected production
The company highlighted its integrated software portfolio, which connects machines and processes into a unified production network. This approach supports real-time monitoring, optimisation, and data-driven decision-making across SMT lines.
Growth in North America
The strong response at the exhibition reflects increasing investment in electronics manufacturing across North America. Demand is particularly strong in sectors linked to AI and data center expansion.
In response, ASMPT is expanding its service organisation in the United States to provide enhanced technical support and local expertise.
Enabling next-generation SMT production
With the introduction of the SIPLACE V platform and complementary solutions, ASMPT is addressing the evolving requirements of high-performance electronics manufacturing. The combination of advanced hardware, integrated software, and local support strengthens its position in a rapidly growing market.
Edited by an industrial journalist, Lekshman Ramdas, with AI assistance.
www.asmpt.com
