08
'25
Written on
Congatec News
08
'25
Written on
MURATA News
Murata introduces the World’s Smallest Class 006003 Size Chip Inductor
The new chip inductor measuring (0.16 mm x 0.08 mm) achieves a 75% volume reduction, advancing miniaturization and high-density mounting in modern electronic devices.
07
'25
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AMD News
AMD Announces First Dell Commercial PCs Powered by AMD Ryzen AI PRO Processors
The AMD Ryzen AI PRO processors will enhance AI-driven productivity, security, efficiency, and enterprise performance with innovative silicon, Copilot+ features, and advanced IT manageability.
07
'25
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Sigfox News
Linxens Unveils Sustainable IoT Smart Labels with Sigfox 0G at CES 2025
Linxens IoT Solutions, UnaBiz, and NXP Semiconductors introduce smart labels to transform supply chains, reduce environmental impact, and support compliance with the EU’s Corporate Sustainability Reporting Directive (CSRD).
07
'25
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Telit News
Telit Cinterion ME310M1-W1 IoT Module Unlocks Global Deployment Opportunities
Featuring Sony’s Altair ALT1350 chipset, the Telit Cinterion ME310M1-W1 is certified by two major U.S. MNOs, opening new possibilities for LTE-M IoT deployments.
06
'25
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Nexcom News
Nexcom's new XPPC xx-10N97 balances power & performance for logistics & self-service applications
The new XPPC 16-10N97 and XPPC 10-10N97 feature Intel processors for robust performance, fanless designs for silent operation, 16:9 widescreens, and diverse I/O connectivity.
06
'25
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Infineon News
Infineon and Flex showcase zone controller design platform for software-defined vehicles
Infineon Technologies AG and Flex, a diversified global manufacturer and Infineon's new preferred automotive design partner, are showcasing the new Flex Modular Zone Controller design platform for software-defined vehicles at CES 2025.
06
'25
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3M News
3M, US Conec Collaborate on Expanded Beam Optical Interconnect Technology for Data Centers
The companies announced a licensing agreement to enhance scalable, high-performance optical connectivity with reduced maintenance for next-generation data centers and advanced networks.
06
'25
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NeuroBlade News
NeuroBlade Empowers Accelerated Next-Gen Data Analytics on New Amazon Elastic Compute Cloud F2 Instances
NeuroBlade has partnered with Amazon EC2 F2 instances, powered by AMD FPGA and EPYC CPU technologies, to enhance performance and efficiency in cloud-native data analytics workloads.
02
'25
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intelec News
