18
'25
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Yokogawa News
Yokogawa Releases AQ6361 Optical Spectrum Analyzer for Production Testing
The AQ6361 benchtop OSA enables fast, cost-effective testing of datacom and telecom components for AI data centers, boasting 20x speed improvement.
18
'25
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Würth Elektronik News
Würth Elektronik introduces its Thyone-e
Thyone-e is a compact, cost-effective alternative to the Thyone-I module for IoT and M2M mesh networks, featuring proven WE-ProWare firmware.
18
'25
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Rohde & Schwarz
Rohde & Schwarz first to achieve GCF approval for 5G FR2 RRM standalone mode conformance test cases
The latest radio resource management (RRM) conformance work item from the Global Certification Forum (GCF) has reached “Active” status following the approval of the Rohde & Schwarz R&S TS8980FTA-M1 5G conformance test system as the first to meet test platform approval criteria (TPAC).
18
'25
Written on
Toshiba News
Toshiba introduces new series of 300mA LDO voltage regulators
The TCR3DMxxA and TCR3EMxxA series of 300mA LDO voltage regulators allow low power consumption and high efficiency of battery-powered devices.
17
'25
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STMicroelectronics News
STMicroelectronics Expands STM32C0 MCU Series with Enhanced Memory and CAN FD Support
STMicroelectronics expands the STM32C0 series with new microcontrollers featuring increased Flash memory, extended interfaces, and integrated CAN FD, offering a cost-effective solution for embedded and industrial applications.
17
'25
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Infineon News
Project “GENIAL!”: Joint electronics roadmap for innovations in the automotive value chain
The automotive industry is facing significant technological challenges in developing new and innovative features and services.
13
'25
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Rohde & Schwarz
Rohde & Schwarz showcases its advanced test solutions for embedded systems at embedded world 2025
Embedded systems form the core of modern electronic devices, spanning power input stages, main control PCBs, motors, motor controls, sensors and user interfaces.
13
'25
Written on
Infineon News
New industrial CoolSiC MOSFETs 650 V G2 in Q-DPAK and TOLL packages offer improved power density
To support this trend and further drive innovation at the system level, Infineon Technologies AG is expanding its portfolio of discrete CoolSiC™ MOSFETs 650 V with two new product families housed in Q-DPAK and TOLL packages.
13
'25
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Toshiba News
