Infineon Technologies AG, in collaboration with 3D time-of-flight specialist and premium partner pmdtechnologies, introduces the IRS2976C Time of Flight (ToF) VGA sensor, a performance-enhancing evolution of the IRS2877C ToF VGA sensor and novel member of the REAL3 product family.
Samsung plans to integrate this technology into the company’s Exynos modem solutions, accelerating the commercialization of 5G satellite communications and paving the way for the 6G-driven Internet of Everything (IoE) era.
SECORA Connect X, an all-in-one turnkey NFC solution from Infineon Technologies AG, supports this trend. The ultra-low-power, boosted NFC solution provides an easy path to EMVCo-based payments.
Sivers Wireless to unveil a comprehensive 5G base station reference design at MWC Barcelona 2023, integrating cutting-edge hardware and software technologies to deliver superior performance and ease of deployment.
Digi-Key has released the first episode in Season 2 of its “Supply Chain Transformed” video series focused on advancements in IoT, connectivity, sensors and asset tracking within the supply chain.
Rohde & Schwarz has partnered with Bullitt and MediaTek to fully test and verify the world’s first satellite-to-mobile messaging 5G smartphone in line with 3GPP Release 17.
LEMO announces the expansion of its field-proven M Series with a new multi coaxial configuration, named LM.232, available in size LM with up to 12x coaxial contacts.
Qualcomm Technologies Inc., Iridium Communications Inc. and Rohde & Schwarz recently collaborated on testing and validating Snapdragon® Satellite, a solution from Qualcomm Technologies for satellite-based connectivity on next-generation Android smartphones.
The 5G industry has been booming, particularly in the networking slicing technology, which has enabled the development of an efficient transmission architecture for 5G networks.