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Congatec News

CONGATEC: PICMG COM-HPC COMMITTEE APPROVES COM-HPC MINI PINOUT

Congatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new credit-card-sized (95x60mm) high-performance Computer-on-Module specification COM-HPC Mini.

TDK News

Exhibitions: TDK spotlights innovations for automotive, robotics, IoT, and information and communication technology at CES 2023

TDK Corporation will showcase more than 30 technology demonstrations and experiences across its component and system solution portfolio for the entire spectrum of electronics applications at the 2023 Consumer Electronics Show (CES) in Las Vegas, Nevada, from January 5th through January 8th. Additionally, TDK plans to release multiple product and partner announcements for its InvenSense brand MEMS sensors throughout the week of the conference.

SK Hynix News

SK hynix Develops MCR DIMM – World’s Fastest Server Memory Module

SK hynix Inc. announced today that it has developed working samples of DDR51 Multiplexer Combined Ranks2 (MCR) Dual In-line Memory Module, the world’s fastest server DRAM product. The new product has been confirmed to operate at the data rate of minimum 8Gbps, and at least 80% faster than 4.8Gbps of the existing DDR5 products.

Melexis News

Melexis releases the magnetic position sensor of the future

The new MLX90376 is an absolute magnetic position sensor IC, handling 360° rotary automotive applications with strong stray field immunity (SFI). Its dual-stacked die PCB-less version is unique to the market.

MURATA News

Compact, High Current Rated Chip Ferrite Beads Meet the Need for Greater Noise Suppression in Automotive Systems

Murata has broadened its portfolio of chip ferrite beads with the introduction of the BLM15PX_SH1 and BLM15PX_BH1 series. Supplied in a 1005 mm (0402 inch) size, these compact and rugged units are highly optimised for automobile deployment.

CEA Leti News

CEA-Leti Quantum Program Director, Maud Vinet, Shares the Path Towards Full Fault-Tolerant Quantum Computing with Si-Based VLSI Technologies In Plenary Talk at IEDM 2022

CEA-Leti presented three papers at IEDM 2022 detailing its recent advances and future challenges in quantum computing using Si-based qubit devices with FDSOI technologies. A plenary talk presented the path towards scalable quantum computers with silicon technology.

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