11 {{ "2024-10-11T00:00:00+00:00" | date "MMM" }} '24

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ZEISS News

PRECISION AND EFFICIENCY IN 3D X-RAY MICROSCOPY

The ZEISS VersaXRM 730 is engineered to meet dynamic needs in various research environments.

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10 {{ "2024-10-10T00:00:00+00:00" | date "MMM" }} '24

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Rohde & Schwarz

Patented antenna digital twin solution from Rohde & Schwarz and IMST optimizes automotive connectivity

Rohde & Schwarz, in collaboration with wireless communications engineering experts IMST GmbH, has developed a patented antenna digital twin solution, effectively addressing a multitude of challenges and delivering considerable benefits for vehicle manufacturers and their suppliers to optimize automotive connectivity.

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10 {{ "2024-10-10T00:00:00+00:00" | date "MMM" }} '24

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Mediatek News

MediaTek’s Dimensity 9400 Flagship SoC Offers Extreme Performance and Efficiency for Latest AI Experiences

New chipset combines a second-generation All Big Core design with industry-leading AI, compute, gaming, and photography capabilities.

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10 {{ "2024-10-10T00:00:00+00:00" | date "MMM" }} '24

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Vishay News

Vishay Intertechnology Launches Industry's First AEC-Q102 Qualified 1 Form A Solid-State Relay with 100 V Load Voltage

Available in the Space-Saving SOP-4 Package, Automotive Grade Device Delivers Industry's Fastest Turn-On and Turn-Off Times of 0.1 ms Typical.

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10 {{ "2024-10-10T00:00:00+00:00" | date "MMM" }} '24

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Broadcom News

BROADCOM DELIVERS ON AI INFRASTRUCTURE VISION WITH INDUSTRY-LEADING SOLUTIONS

Broadcom will highlight advancements across the areas via a series of presentations, product demonstrations, and other forums at the 2024 Open Compute Project (OCP) Global Summit.

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10 {{ "2024-10-10T00:00:00+00:00" | date "MMM" }} '24

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Baumer News

INSPECTING THE INVISIBLE WITH BAUMER SWIR CAMERAS

The new CX.SWIR.XC cameras acquire wavelengths ranging from 400 to 1700 nm and therefore can be deployed for tasks both the visible and non-visible light spectrum.

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09 {{ "2024-10-09T00:00:00+00:00" | date "MMM" }} '24

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TDK News

TDK offers CeraLink chip capacitors for use in applications with 800 V bus voltage

The company has expanded its line of CeraLink capacitor series B58043 in the EIA 2220 footprint by adding two new 900 V types – one with standard termination and one with soft termination.

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09 {{ "2024-10-09T00:00:00+00:00" | date "MMM" }} '24

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Silicon Labs News

Silicon Labs' Series 3 Platform Guides the IoT Evolution

Series 3 devices answers challenges that continued acceleration of IoT poses--demands for more processing power at far-edge devices across IoT applications & demands for increasingly portable, secure, compute-intensive applications.

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09 {{ "2024-10-09T00:00:00+00:00" | date "MMM" }} '24

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Kontron News

A Low-power Ultra-compact Platform for AI-enabled IoT Edge Applications

Kontron's Single Board Computer 2.5”-SBC-AML/ADN with Intel Atom x7000(R)E-, Intel^® Core i3 N- & Intel N-Series Processors.

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09 {{ "2024-10-09T00:00:00+00:00" | date "MMM" }} '24

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Keysight technologies News

KEYSIGHT UNVEILS 3KV HIGH VOLTAGE WAFER TEST SYSTEM FOR POWER SEMICONDUCTORS

Keysight's 4881HV High Voltage Wafer Test System improves the productivity of power semiconductor manufacturers by enabling parametric tests up to 3kV supporting high and low-voltage in one-pass test.

Read more…

Technical Articles

75 GB/s Data Acquisition to Disk

PRECISION AND EFFICIENCY IN 3D X-RAY MICROSCOPY

The ZEISS VersaXRM 730 is engineered to meet dynamic needs in various research environments.

Patented antenna digital twin solution from Rohde & Schwarz and IMST optimizes automotive connectivity

MediaTek’s Dimensity 9400 Flagship SoC Offers Extreme Performance and Efficiency for Latest AI Experiences

New chipset combines a second-generation All Big Core design with industry-leading AI, compute, gaming, and photography capabilities.

Vishay Intertechnology Launches Industry's First AEC-Q102 Qualified 1 Form A Solid-State Relay with 100 V Load Voltage

Available in the Space-Saving SOP-4 Package, Automotive Grade Device Delivers Industry's Fastest Turn-On and Turn-Off Times of 0.1 ms Typical.

BROADCOM DELIVERS ON AI INFRASTRUCTURE VISION WITH INDUSTRY-LEADING SOLUTIONS

Broadcom will highlight advancements across the areas via a series of presentations, product demonstrations, and other forums at the 2024 Open Compute Project (OCP) Global Summit.

INSPECTING THE INVISIBLE WITH BAUMER SWIR CAMERAS

The new CX.SWIR.XC cameras acquire wavelengths ranging from 400 to 1700 nm and therefore can be deployed for tasks both the visible and non-visible light spectrum.

TDK offers CeraLink chip capacitors for use in applications with 800 V bus voltage

The company has expanded its line of CeraLink capacitor series B58043 in the EIA 2220 footprint by adding two new 900 V types – one with standard termination and one with soft termination.

Silicon Labs' Series 3 Platform Guides the IoT Evolution

Series 3 devices answers challenges that continued acceleration of IoT poses--demands for more processing power at far-edge devices across IoT applications & demands for increasingly portable, secure, compute-intensive applications.

A Low-power Ultra-compact Platform for AI-enabled IoT Edge Applications

Kontron's Single Board Computer 2.5”-SBC-AML/ADN with Intel Atom x7000(R)E-, Intel^® Core i3 N- & Intel N-Series Processors.

KEYSIGHT UNVEILS 3KV HIGH VOLTAGE WAFER TEST SYSTEM FOR POWER SEMICONDUCTORS

Keysight's 4881HV High Voltage Wafer Test System improves the productivity of power semiconductor manufacturers by enabling parametric tests up to 3kV supporting high and low-voltage in one-pass test.

International

Technical Articles

The ZEISS VersaXRM 730 is engineered to meet dynamic needs in various research environments.

New chipset combines a second-generation All Big Core design with industry-leading AI, compute, gaming, and photography capabilities.

Available in the Space-Saving SOP-4 Package, Automotive Grade Device Delivers Industry's Fastest Turn-On and Turn-Off Times of 0.1 ms Typical.

Broadcom will highlight advancements across the areas via a series of presentations, product demonstrations, and other forums at the 2024 Open Compute Project (OCP) Global Summit.

The new CX.SWIR.XC cameras acquire wavelengths ranging from 400 to 1700 nm and therefore can be deployed for tasks both the visible and non-visible light spectrum.

The company has expanded its line of CeraLink capacitor series B58043 in the EIA 2220 footprint by adding two new 900 V types – one with standard termination and one with soft termination.

Series 3 devices answers challenges that continued acceleration of IoT poses--demands for more processing power at far-edge devices across IoT applications & demands for increasingly portable, secure, compute-intensive applications.

Kontron's Single Board Computer 2.5”-SBC-AML/ADN with Intel Atom x7000(R)E-, Intel® Core i3 N- & Intel N-Series Processors.

Keysight's 4881HV High Voltage Wafer Test System improves the productivity of power semiconductor manufacturers by enabling parametric tests up to 3kV supporting high and low-voltage in one-pass test.

International

Kontron's Single Board Computer 2.5”-SBC-AML/ADN with Intel Atom x7000(R)E-, Intel^® Core i3 N- & Intel N-Series Processors.