26 {{ "2024-09-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-09-26T00:00:00+00:00" | date "longDate" }}

ANSYS News

TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design

Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and high-speed data communication semiconductors.

Read more…

26 {{ "2024-09-26T00:00:00+00:00" | date "MMM" }} '24

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ams OSRAM News

ALIYOS™ LED-on-foil technology redefines automotive lighting for ams OSRAM

The technology enables ams OSRAM to apply LEDs onto a thin, flexible and transparent substrate. This advancement paves the way for light to emerge from surfaces, offering a truly fascinating and interactive experience.

Read more…

26 {{ "2024-09-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-09-26T00:00:00+00:00" | date "longDate" }}

Review Displays News

An extensive range of high quality, industry standard TFT displays modules

Review Display Systems has announced the availability of a comprehensive range of medium-sized TFT displays that are suitable for a broad range of industry sectors, applications and operating environments.

Read more…

26 {{ "2024-09-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-09-26T00:00:00+00:00" | date "longDate" }}

ASUS News

ASUS Introduces All-New Intel Xeon 6 Processor Servers

World-class expertise and engineering combine to deliver next-generation servers ready to empower high-performance computing, peak performance and maximum utilization.

Read more…

25 {{ "2024-09-25T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-09-25T00:00:00+00:00" | date "longDate" }}

Alphawave Semi News

Alphawave Semi and InnoLight Showcase 128Gbps PCIe Gen 7.0 over LPO at ECOC 2024

Alphawave Semi has announced an extension of its collaboration with InnoLight Technology, the leader in data center and AI networking optics, with a demonstration of next generation low power, low latency linear pluggable optics (LPO).

Read more…

25 {{ "2024-09-25T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-09-25T00:00:00+00:00" | date "longDate" }}

CML Microcircuits News

CML launches sub-GHz band GaAs 2W linear power amplifier to ease UHF system development

CML Micro introduces the CMX90A006, a 2 W power amplifier designed for linear performance and reliability in wireless transmitter applications, extending its SµRF range of sub-GHz MMICs.

Read more…

25 {{ "2024-09-25T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-09-25T00:00:00+00:00" | date "longDate" }}

Toshiba News

TOSHIBA INTRODUCES 32GBPS 2:1 MULTIPLEXER/1:2 DEMULTIPLEXER SWITCHES FOR HIGH-SPEED SIGNALS

1-lane 2-differential channel switches support PCIe 5.0, USB4 and Thunderbolt 4 interfaces for connecting and expanding peripheral devices in PCs, server equipment, and mobile devices.

Read more…

24 {{ "2024-09-24T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-09-24T00:00:00+00:00" | date "longDate" }}

TDK News

TDK to showcase electric vehicle solutions at the Electric & Hybrid Vehicle Technology Expo 2024

TDK and TDK-Lambda Americas to present products driving future mobility for electric vehicles and EV fast charging, and Advanced and General-Purpose Programmable DC power supplies.

Read more…

24 {{ "2024-09-24T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-09-24T00:00:00+00:00" | date "longDate" }}

Broadcom News

BROADCOM DELIVERS INDUSTRY-LEADING 200G/LANE DSP FOR GEN AI INFRASTRUCTURE

Sian and Sian2 DSPs enable pluggable modules with 200G/lane interfaces that are foundational to connect next-generation AI clusters.

Read more…

24 {{ "2024-09-24T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-09-24T00:00:00+00:00" | date "longDate" }}

Nvidia News

NVIDIA AI AERIAL LAUNCHES TO OPTIMIZE WIRELESS NETWORKS, DELIVER NEW GENERATIVE AI EXPERIENCES ON ONE PLATFORM

Supporting a growing ecosystem for AI-RAN, the new platform will transform radio access network (RAN) technology into AI-driven computing infrastructure.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design

Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and high-speed data communication semiconductors.

ALIYOS™ LED-on-foil technology redefines automotive lighting for ams OSRAM

The technology enables ams OSRAM to apply LEDs onto a thin, flexible and transparent substrate. This advancement paves the way for light to emerge from surfaces, offering a truly fascinating and interactive experience.

An extensive range of high quality, industry standard TFT displays modules

Review Display Systems has announced the availability of a comprehensive range of medium-sized TFT displays that are suitable for a broad range of industry sectors, applications and operating environments.

ASUS Introduces All-New Intel Xeon 6 Processor Servers

World-class expertise and engineering combine to deliver next-generation servers ready to empower high-performance computing, peak performance and maximum utilization.

Alphawave Semi and InnoLight Showcase 128Gbps PCIe Gen 7.0 over LPO at ECOC 2024

Alphawave Semi has announced an extension of its collaboration with InnoLight Technology, the leader in data center and AI networking optics, with a demonstration of next generation low power, low latency linear pluggable optics (LPO).

CML launches sub-GHz band GaAs 2W linear power amplifier to ease UHF system development

CML Micro introduces the CMX90A006, a 2 W power amplifier designed for linear performance and reliability in wireless transmitter applications, extending its SµRF range of sub-GHz MMICs.

TOSHIBA INTRODUCES 32GBPS 2:1 MULTIPLEXER/1:2 DEMULTIPLEXER SWITCHES FOR HIGH-SPEED SIGNALS

1-lane 2-differential channel switches support PCIe 5.0, USB4 and Thunderbolt 4 interfaces for connecting and expanding peripheral devices in PCs, server equipment, and mobile devices.

TDK to showcase electric vehicle solutions at the Electric & Hybrid Vehicle Technology Expo 2024

TDK and TDK-Lambda Americas to present products driving future mobility for electric vehicles and EV fast charging, and Advanced and General-Purpose Programmable DC power supplies.

BROADCOM DELIVERS INDUSTRY-LEADING 200G/LANE DSP FOR GEN AI INFRASTRUCTURE

Sian and Sian2 DSPs enable pluggable modules with 200G/lane interfaces that are foundational to connect next-generation AI clusters.

NVIDIA AI AERIAL LAUNCHES TO OPTIMIZE WIRELESS NETWORKS, DELIVER NEW GENERATIVE AI EXPERIENCES ON ONE PLATFORM

Supporting a growing ecosystem for AI-RAN, the new platform will transform radio access network (RAN) technology into AI-driven computing infrastructure.

International