20 {{ "2024-05-20T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-20T00:00:00+00:00" | date "longDate" }}

Cortec News

Three Easy Ways to Clean/Protect Sensitive Electronics

Cortec^® offers three easy ways to do so without harming sensitive components.

Read more…

20 {{ "2024-05-20T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-20T00:00:00+00:00" | date "longDate" }}

Iwave Systems News

A Modular SoM Powered by the Advanced i.MX 95 Applications Processor from NXP

iWave is excited to announce the launch of the iW-RainboW-G61M System on Module, powered by NXP^® Semiconductors i.MX 95 applications processor. Built on the SMARC v2.1.1 standard, the SoM provides product designers with scalability and modularity.

Read more…

20 {{ "2024-05-20T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-20T00:00:00+00:00" | date "longDate" }}

Toshiba News

TOSHIBA RELEASES PHOTOCOUPLERS FOR SPEED-CHALLENGED APPLICATIONS

New devices offer high performance for slow input signals and slow startup power supplies.

Read more…

17 {{ "2024-05-17T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-17T00:00:00+00:00" | date "longDate" }}

Nvidia News

NVIDIA Accelerates Quantum Computing Centers Worldwide With CUDA-Q Platform

Supercomputers in Germany, Japan, and Poland Incorporate Grace-Hopper and Quantum-Classical Accelerated Supercomputing Platform to Advance Quantum Computing Research.

Read more…

17 {{ "2024-05-17T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-17T00:00:00+00:00" | date "longDate" }}

SemiQ News

SemiQ to Unveil High-Performance 1200V Half-Bridge Modules in S3 Package at PCIM Europe 2024

SemiQ will showcase its latest SiC power solutions and recently launched Known-Good-Die (KGD) screening process at PCIM Europe 2024 in Nuremberg from June 11-13, 2024.

Read more…

16 {{ "2024-05-16T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-16T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM at PCIM Europe 2024: Empowering Growth, Inspiring Innovation

ROHM showcases its new power semiconductor solutions at PCIM Europe, a leading power electronics trade fair in Nuremberg, Germany (June 11th – 13th), focusing on wide bandgap devices.

Read more…

16 {{ "2024-05-16T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-16T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon presents XENSIV™ TLE49SR angle sensor family with outstanding stray field robustness

Infineon Technologies AG introduces the new XENSIV™ TLE49SR angle sensor family, which combines excellent stray field immunity with high accuracy. The sensors are ideal for applications of safety-critical automotive chassis systems such as electric power steering and vehicle height leveling.

Read more…

16 {{ "2024-05-16T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-16T00:00:00+00:00" | date "longDate" }}

Siemens News

Siemens and Foxconn team up to optimize forward-thinking manufacturing

Siemens and Foxconn sign a memorandum of understanding highlighting joint commitment to sustainability.

Read more…

16 {{ "2024-05-16T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-16T00:00:00+00:00" | date "longDate" }}

Toshiba News

TOSHIBA SUCCESSFULLY DEMONSTRATES NEARLINE HDDS WITH MASSIVE CAPACITY OF OVER 30 TERABYTES

The demonstration drives represent a major milestone in the advance towards commercial products based on each of these emerging recording formats.

Read more…

15 {{ "2024-05-15T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-15T00:00:00+00:00" | date "longDate" }}

Rohde & Schwarz

Rohde & Schwarz introduces the MXO 5C series, the world’s most compact oscilloscope with up to 2 GHz bandwidth

Rohde & Schwarz extends its portfolio with a 2U high oscilloscope/digitizer tailored for rack mount and other applications where a low-profile form factor is critical. The new MXO 5C series is the company’s first oscilloscope without an integrated display. It delivers the same peformance as the previously introduced MXO 5 series, but with a fourth of the vertical height.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Three Easy Ways to Clean/Protect Sensitive Electronics

Cortec^® offers three easy ways to do so without harming sensitive components.

A Modular SoM Powered by the Advanced i.MX 95 Applications Processor from NXP

iWave is excited to announce the launch of the iW-RainboW-G61M System on Module, powered by NXP^® Semiconductors i.MX 95 applications processor. Built on the SMARC v2.1.1 standard, the SoM provides product designers with scalability and modularity.

TOSHIBA RELEASES PHOTOCOUPLERS FOR SPEED-CHALLENGED APPLICATIONS

New devices offer high performance for slow input signals and slow startup power supplies.

NVIDIA Accelerates Quantum Computing Centers Worldwide With CUDA-Q Platform

Supercomputers in Germany, Japan, and Poland Incorporate Grace-Hopper and Quantum-Classical Accelerated Supercomputing Platform to Advance Quantum Computing Research.

SemiQ to Unveil High-Performance 1200V Half-Bridge Modules in S3 Package at PCIM Europe 2024

SemiQ will showcase its latest SiC power solutions and recently launched Known-Good-Die (KGD) screening process at PCIM Europe 2024 in Nuremberg from June 11-13, 2024.

ROHM at PCIM Europe 2024: Empowering Growth, Inspiring Innovation

ROHM showcases its new power semiconductor solutions at PCIM Europe, a leading power electronics trade fair in Nuremberg, Germany (June 11th – 13th), focusing on wide bandgap devices.

Infineon presents XENSIV™ TLE49SR angle sensor family with outstanding stray field robustness

Infineon Technologies AG introduces the new XENSIV™ TLE49SR angle sensor family, which combines excellent stray field immunity with high accuracy. The sensors are ideal for applications of safety-critical automotive chassis systems such as electric power steering and vehicle height leveling.

Siemens and Foxconn team up to optimize forward-thinking manufacturing

Siemens and Foxconn sign a memorandum of understanding highlighting joint commitment to sustainability.

TOSHIBA SUCCESSFULLY DEMONSTRATES NEARLINE HDDS WITH MASSIVE CAPACITY OF OVER 30 TERABYTES

The demonstration drives represent a major milestone in the advance towards commercial products based on each of these emerging recording formats.

Rohde & Schwarz introduces the MXO 5C series, the world’s most compact oscilloscope with up to 2 GHz bandwidth

International

Market Overview

Technical Articles

Case studies

Cortec® offers three easy ways to do so without harming sensitive components.

iWave is excited to announce the launch of the iW-RainboW-G61M System on Module, powered by NXP® Semiconductors i.MX 95 applications processor. Built on the SMARC v2.1.1 standard, the SoM provides product designers with scalability and modularity.

New devices offer high performance for slow input signals and slow startup power supplies.

Supercomputers in Germany, Japan, and Poland Incorporate Grace-Hopper and Quantum-Classical Accelerated Supercomputing Platform to Advance Quantum Computing Research.

SemiQ will showcase its latest SiC power solutions and recently launched Known-Good-Die (KGD) screening process at PCIM Europe 2024 in Nuremberg from June 11-13, 2024.

ROHM showcases its new power semiconductor solutions at PCIM Europe, a leading power electronics trade fair in Nuremberg, Germany (June 11th – 13th), focusing on wide bandgap devices.

Infineon Technologies AG introduces the new XENSIV™ TLE49SR angle sensor family, which combines excellent stray field immunity with high accuracy. The sensors are ideal for applications of safety-critical automotive chassis systems such as electric power steering and vehicle height leveling.

Siemens and Foxconn sign a memorandum of understanding highlighting joint commitment to sustainability.

The demonstration drives represent a major milestone in the advance towards commercial products based on each of these emerging recording formats.

International

Cortec^® offers three easy ways to do so without harming sensitive components.

iWave is excited to announce the launch of the iW-RainboW-G61M System on Module, powered by NXP^® Semiconductors i.MX 95 applications processor. Built on the SMARC v2.1.1 standard, the SoM provides product designers with scalability and modularity.