14 {{ "2024-05-14T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-14T00:00:00+00:00" | date "longDate" }}

ARROW News

Arrow Electronics Signs EMEA Distribution Agreement with The Things Industries to Deliver LoRaWAN Device Design Solutions

Breaking down the complexities of LoRaWAN development to reduce time-to-market for IoT projects and lower total cost of ownership.

Read more…

13 {{ "2024-05-13T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-13T00:00:00+00:00" | date "longDate" }}

Vishay News

Vishay Intertechnology Space-Grade Planar Transformers Offer Lower Cost, Smaller Size, and Higher Density Than Traditional Planar Devices

Featuring a Unique Winding Structure and Building Technique, Customizable Devices Are Qualified to MIL-STD-981 Class S Standard.

Read more…

10 {{ "2024-05-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-10T00:00:00+00:00" | date "longDate" }}

Micron News

Micron Delivers Crucial LPCAMM2 with LPDDR5X Memory for the New AI-Ready Lenovo ThinkPad P1 Gen 7 Workstation

Groundbreaking upgradeable laptop memory form factor reduces power consumption while delivering 1.3 times faster performance over DDR5 SODIMM memory.

Read more…

09 {{ "2024-05-09T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-09T00:00:00+00:00" | date "longDate" }}

Samsung News

Leading Memory Innovation with HBM3E

Samsung is leading the pack with its latest 5th generation high bandwidth memory device.

Read more…

09 {{ "2024-05-09T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-09T00:00:00+00:00" | date "longDate" }}

Rohde & Schwarz

Dürr and Rohde & Schwarz collaborate on ADAS/AD functional testing for EOL and PTI

Automated and autonomous vehicles, which rely on sensors like cameras and radar, either assist or take over decision-making in traffic situations.

Read more…

09 {{ "2024-05-09T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-09T00:00:00+00:00" | date "longDate" }}

Melexis News

MELEXIS INTRODUCES MLX90427 POSITION SENSING FOR STEER-BY-WIRE

This product has been specifically engineered to meet the current and future technical requirements of the automotive industry.

Read more…

08 {{ "2024-05-08T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-08T00:00:00+00:00" | date "longDate" }}

Qualcomm News

Qualcomm Accelerates Development for Copilot+ PCs with Snapdragon Dev Kit for Windows

The Snapdragon Dev Kit for Windows, powered by Snapdragon X Elite, is a compact-form-factor PC designed for Windows developers to take advantage of the next-gen AI PC capabilities of Snapdragon.

Read more…

08 {{ "2024-05-08T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-08T00:00:00+00:00" | date "longDate" }}

Bourns News

Bourns TLVR Inductors Deliver Extremely High Current Capabilities to Match Today’s Data-Driven Application Performance Demands

Engineered with a dual-winding structure and low inductance, the Bourns^® Model TLVR1005T and TLVR1105T Series provides fast transient response.

Read more…

08 {{ "2024-05-08T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-08T00:00:00+00:00" | date "longDate" }}

Mediatek News

MediaTek Boosts Flagship Smartphone Performance with Dimensity 9300+ SoC

New chip speeds up generative AI processing at the edge to run LLMs faster.

Read more…

08 {{ "2024-05-08T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-08T00:00:00+00:00" | date "longDate" }}

NETGEAR News

NETGEAR BRINGS WIFI 7 TO ITS FLAGSHIP ORBI FAMILY, UNLEASHING ELITE CONNECTIVITY

NETGEAR Orbi 970 Series boasts elegant, new design, high-performance antennas and groundbreaking Enhanced Dedicated Backhaul.

Read more…

Technical Articles

75 GB/s Data Acquisition to Disk

Arrow Electronics Signs EMEA Distribution Agreement with The Things Industries to Deliver LoRaWAN Device Design Solutions

Breaking down the complexities of LoRaWAN development to reduce time-to-market for IoT projects and lower total cost of ownership.

Vishay Intertechnology Space-Grade Planar Transformers Offer Lower Cost, Smaller Size, and Higher Density Than Traditional Planar Devices

Featuring a Unique Winding Structure and Building Technique, Customizable Devices Are Qualified to MIL-STD-981 Class S Standard.

Micron Delivers Crucial LPCAMM2 with LPDDR5X Memory for the New AI-Ready Lenovo ThinkPad P1 Gen 7 Workstation

Groundbreaking upgradeable laptop memory form factor reduces power consumption while delivering 1.3 times faster performance over DDR5 SODIMM memory.

Leading Memory Innovation with HBM3E

Samsung is leading the pack with its latest 5th generation high bandwidth memory device.

Dürr and Rohde & Schwarz collaborate on ADAS/AD functional testing for EOL and PTI

Automated and autonomous vehicles, which rely on sensors like cameras and radar, either assist or take over decision-making in traffic situations.

MELEXIS INTRODUCES MLX90427 POSITION SENSING FOR STEER-BY-WIRE

This product has been specifically engineered to meet the current and future technical requirements of the automotive industry.

Qualcomm Accelerates Development for Copilot+ PCs with Snapdragon Dev Kit for Windows

The Snapdragon Dev Kit for Windows, powered by Snapdragon X Elite, is a compact-form-factor PC designed for Windows developers to take advantage of the next-gen AI PC capabilities of Snapdragon.

Bourns TLVR Inductors Deliver Extremely High Current Capabilities to Match Today’s Data-Driven Application Performance Demands

Engineered with a dual-winding structure and low inductance, the Bourns^® Model TLVR1005T and TLVR1105T Series provides fast transient response.

MediaTek Boosts Flagship Smartphone Performance with Dimensity 9300+ SoC

New chip speeds up generative AI processing at the edge to run LLMs faster.

NETGEAR BRINGS WIFI 7 TO ITS FLAGSHIP ORBI FAMILY, UNLEASHING ELITE CONNECTIVITY

NETGEAR Orbi 970 Series boasts elegant, new design, high-performance antennas and groundbreaking Enhanced Dedicated Backhaul.

International

Technical Articles

Breaking down the complexities of LoRaWAN development to reduce time-to-market for IoT projects and lower total cost of ownership.

Featuring a Unique Winding Structure and Building Technique, Customizable Devices Are Qualified to MIL-STD-981 Class S Standard.

Groundbreaking upgradeable laptop memory form factor reduces power consumption while delivering 1.3 times faster performance over DDR5 SODIMM memory.

Samsung is leading the pack with its latest 5th generation high bandwidth memory device.

Automated and autonomous vehicles, which rely on sensors like cameras and radar, either assist or take over decision-making in traffic situations.

This product has been specifically engineered to meet the current and future technical requirements of the automotive industry.

The Snapdragon Dev Kit for Windows, powered by Snapdragon X Elite, is a compact-form-factor PC designed for Windows developers to take advantage of the next-gen AI PC capabilities of Snapdragon.

Engineered with a dual-winding structure and low inductance, the Bourns® Model TLVR1005T and TLVR1105T Series provides fast transient response.

New chip speeds up generative AI processing at the edge to run LLMs faster.

NETGEAR Orbi 970 Series boasts elegant, new design, high-performance antennas and groundbreaking Enhanced Dedicated Backhaul.

International

Engineered with a dual-winding structure and low inductance, the Bourns^® Model TLVR1005T and TLVR1105T Series provides fast transient response.