24 {{ "2024-04-24T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-24T00:00:00+00:00" | date "longDate" }}

Fraunhofer News

Transparent emissive microdisplays for ultra-light and compact augmented reality systems

As part of the HOT project (High-performance transparent and flexible microelectronics for photonic and optical applications), scientists from the Fraunhofer Institute for Photonic Microsystems IPMS have developed a semi-transparent microdisplay.

Read more…

24 {{ "2024-04-24T00:00:00+00:00" | date "MMM" }} '24

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Rohm Semiconductors News

ROHM’s New Energy-Saving DC-DC Converter ICs Offered in the TSOT23 Package

Compact size reduces component area by 72%, contributing to smaller power supplies in consumer and industrial equipment.

Read more…

24 {{ "2024-04-24T00:00:00+00:00" | date "MMM" }} '24

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Rohde & Schwarz

Rohde & Schwarz and IPG Automotive unveil a complete Hardware-in-the-Loop automotive radar test solution

Rohde & Schwarz has teamed up with IPG Automotive, a pioneer in virtual test driving, to redefine automotive radar Hardware-in-the-Loop (HIL) integration testing and thereby reducing the cost by bringing Autonomous Driving (AD) testing from the proving ground to the development lab.

Read more…

24 {{ "2024-04-24T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-24T00:00:00+00:00" | date "longDate" }}

Thinesolutions News

THine Introduces THEIA-CAM 13MP PDAF Camera Kit for NVIDIA Jetson Orin NX/Nano

THine Solutions has introduced the THEIA-CAM 13MP PDAF Camera, THSCJ101, for NVIDIA Jetson Orin NX and Jetson Orin Nano platforms, enabling easy integration of advanced imaging capabilities.

Read more…

24 {{ "2024-04-24T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-24T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser Electronics New Product Insider: Over 10,000 New Parts Added in First Quarter of 2024

Mouser Electronics is focused on the rapid introduction of new products and technologies, giving customers an edge and helping speed time to market.

Read more…

24 {{ "2024-04-24T00:00:00+00:00" | date "MMM" }} '24

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Intel News

INTEL GAUDI, XEON AND AI PC ACCELERATE META LLAMA 3 GENAI WORKLOADS

Intel’s AI products offer developers the latest optimizations to run Meta Llama 3, its next-generation large language model.

Read more…

23 {{ "2024-04-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-23T00:00:00+00:00" | date "longDate" }}

Silicon Labs News

Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free IoT

Silicon Labs secure intelligent wireless technology for a more connected world announced their new xG22E family of Wireless SoCs designed to operate within the ultra-low power envelope required for battery-free, energy harvesting applications.

Read more…

23 {{ "2024-04-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-23T00:00:00+00:00" | date "longDate" }}

Bender News

The new Bender's ISOMETER^® iso175

Bender presents the ISOMETER^® iso175, a pioneering insulation monitoring device that revolutionises safety in these vehicles.

Read more…

23 {{ "2024-04-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-23T00:00:00+00:00" | date "longDate" }}

Rohde & Schwarz

Rohde & Schwarz introduces new R&S SMB100B microwave signal generator for analog signal generation up to 40 GHz

Available with four frequency options each covering from 8 kHz to 12.75 GHz, 20 GHz, 31.8 GHz or 40 GHz, the new R&S SMB100B microwave signal generator from Rohde & Schwarz brings excellent output power, spectral purity, very low close-in phase noise, and practically no wideband noise to analog microwave signal generation.

Read more…

23 {{ "2024-04-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-23T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

ROHM and STMicroelectronics has announced the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Transparent emissive microdisplays for ultra-light and compact augmented reality systems

As part of the HOT project (High-performance transparent and flexible microelectronics for photonic and optical applications), scientists from the Fraunhofer Institute for Photonic Microsystems IPMS have developed a semi-transparent microdisplay.

ROHM’s New Energy-Saving DC-DC Converter ICs Offered in the TSOT23 Package

Compact size reduces component area by 72%, contributing to smaller power supplies in consumer and industrial equipment.

Rohde & Schwarz and IPG Automotive unveil a complete Hardware-in-the-Loop automotive radar test solution

Rohde & Schwarz has teamed up with IPG Automotive, a pioneer in virtual test driving, to redefine automotive radar Hardware-in-the-Loop (HIL) integration testing and thereby reducing the cost by bringing Autonomous Driving (AD) testing from the proving ground to the development lab.

THine Introduces THEIA-CAM 13MP PDAF Camera Kit for NVIDIA Jetson Orin NX/Nano

THine Solutions has introduced the THEIA-CAM 13MP PDAF Camera, THSCJ101, for NVIDIA Jetson Orin NX and Jetson Orin Nano platforms, enabling easy integration of advanced imaging capabilities.

Mouser Electronics New Product Insider: Over 10,000 New Parts Added in First Quarter of 2024

Mouser Electronics is focused on the rapid introduction of new products and technologies, giving customers an edge and helping speed time to market.

INTEL GAUDI, XEON AND AI PC ACCELERATE META LLAMA 3 GENAI WORKLOADS

Intel’s AI products offer developers the latest optimizations to run Meta Llama 3, its next-generation large language model.

Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free IoT

Silicon Labs secure intelligent wireless technology for a more connected world announced their new xG22E family of Wireless SoCs designed to operate within the ultra-low power envelope required for battery-free, energy harvesting applications.

The new Bender's ISOMETER^® iso175

Bender presents the ISOMETER^® iso175, a pioneering insulation monitoring device that revolutionises safety in these vehicles.

Rohde & Schwarz introduces new R&S SMB100B microwave signal generator for analog signal generation up to 40 GHz

ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

ROHM and STMicroelectronics has announced the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.

International

Market Overview

Technical Articles

Case studies

As part of the HOT project (High-performance transparent and flexible microelectronics for photonic and optical applications), scientists from the Fraunhofer Institute for Photonic Microsystems IPMS have developed a semi-transparent microdisplay.

Compact size reduces component area by 72%, contributing to smaller power supplies in consumer and industrial equipment.

Rohde & Schwarz has teamed up with IPG Automotive, a pioneer in virtual test driving, to redefine automotive radar Hardware-in-the-Loop (HIL) integration testing and thereby reducing the cost by bringing Autonomous Driving (AD) testing from the proving ground to the development lab.

THine Solutions has introduced the THEIA-CAM 13MP PDAF Camera, THSCJ101, for NVIDIA Jetson Orin NX and Jetson Orin Nano platforms, enabling easy integration of advanced imaging capabilities.

Mouser Electronics is focused on the rapid introduction of new products and technologies, giving customers an edge and helping speed time to market.

Intel’s AI products offer developers the latest optimizations to run Meta Llama 3, its next-generation large language model.

Silicon Labs secure intelligent wireless technology for a more connected world announced their new xG22E family of Wireless SoCs designed to operate within the ultra-low power envelope required for battery-free, energy harvesting applications.

Bender presents the ISOMETER® iso175, a pioneering insulation monitoring device that revolutionises safety in these vehicles.

ROHM and STMicroelectronics has announced the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.

International

Bender presents the ISOMETER^® iso175, a pioneering insulation monitoring device that revolutionises safety in these vehicles.