23
'22
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Anritsu News
23
'22
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Wise-integration News
Wise-integration Launches Most-Compact Gallium Nitride Half-Bridge Power IC
WI62120 Gives Power Electronics Designers New Density, Performance, Efficiency Options Wide Range of Applications Seen in Consumer, Mobile, Industrial Power Supplies.
23
'22
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Telit News
Telit to Reinvent IoT with New NExT Embedded Portfolio of Out-of-the-box Connectivity Solutions
Telit, a global enabler of the Internet of Things (IoT), today announced it is broadening its IoT connectivity portfolio with the introduction of Telit NExT Embedded.
23
'22
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Mouser News
Mouser Wins Top NPI Distributor Award from Digi International
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, announces that it has been named the New Product Introduction (NPI) Distributor of the Year for 2021 by Digi International, a leading global provider of the Internet of Things, connectivity products and services.
23
'22
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ST News
STMicroelectronics delivers breakthrough in non-volatile memory with industry’s first Serial Page EEPROM
Building upon its proven expertise in serial EEPROM technology, STMicroelectronics has introduced the market’s first Serial Page EEPROM. This brand-new class of EEPROM is a high-density, page-erasable SPI memory that delivers unique and unprecedented flexibility and performance with ultra-low power consumption.
22
'22
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ST News
STMicroelectronics’ new inertial modules enable AI training inside the sensor
On-chip signal processing core, programmable with ST’s NanoEdge AI Studio, is ideal for machine-learning applications.
22
'22
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ONSEMI News
onsemi Advances Industrial Ethernet with 10BASE-T1S Controller
The NCN26010 supports multi-point Ethernet with up to 70% fewer wires and an 80% reduction in installation costs.
22
'22
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NXP News
NXP EXTENDS S32 AUTOMOTIVE PLATFORM WITH S32Z AND S32E REAL-TIME PROCESSOR FAMILIES FOR NEW SOFTWARE-DEFINED VEHICLES
New class of processors with critical deterministic behavior of safe MCUs, but with unparalleled combination of gigahertz speed, multi-application isolation and memory expansion capabilities. Ideal for safe integration of cross-domain vehicle functions for software-defined vehicles.
22
'22
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TDK News
WIRELESS POWER TRANSFER: TDK’S NEW DRAMATICALLY THINNER PATTERN COILS SET TO REVOLUTIONIZE WIRELESS CHARGING
TDK Corporation has introduced a thin pattern coil to support the wireless charging of next generation mobile devices. Industry-leading 0.76 ㎜ thickness achieved via unique pattern coil technology.
22
'22
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Nexperia News
