01 {{ "2024-04-01T00:00:00+00:00" | date "MMM" }} '24

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ARROW News

Arrow Electronics and Infineon Technologies introduce 240W USB PD3.1 Reference Design

New reference design supports up to 48V@5A Power Delivery Object sink mode, which is the highest level achievable with the latest USB Power Delivery standards.

Read more…

01 {{ "2024-04-01T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-01T00:00:00+00:00" | date "longDate" }}

Antaira News

Antaira Ethernet Extension Kit Supports Long-Reach Transmission of Data and PoE

Antaira Technologies launched a turnkey solution kit that extends the reach of 10/100 Ethernet and 802.3at PoE over UTP copper cabling up to 800 meters for reliable point-to-point connectivity.

Read more…

30 {{ "2024-03-30T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-30T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon introduces 80 V MOSFET OptiMOS™ 7 with lowest on-resistance in the industry for automotive applications

Infineon Technologies AG has introduced the first product in its new advanced power MOSFET technology OptiMOS™ 7 80 V:.

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30 {{ "2024-03-30T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-30T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser Signs Global Distribution Agreement with Vox Power to Deliver Innovative Power Solutions

Mouser Electronics the authorised global distributor with the newest electronic components and industrial automation products, today announces a new global distribution agreement with Vox Power, a leading manufacturer of AC/DC power supplies and DC/DC converters.

Read more…

29 {{ "2024-03-29T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-29T00:00:00+00:00" | date "longDate" }}

TDK News

TDK offers DC link capacitors for +105 °C

TDK Corporation presents a new series of EPCOS power capacitors for DC link applications designed for an operating temperature of up to +105 °C.

Read more…

29 {{ "2024-03-29T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-29T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMICROELECTRONICS PRESENTS ALL-IN-ONE MEMS STUDIO DESKTOP SOFTWARE SOLUTION

Easy to use, efficient, and consolidated tool supports application development for next-gen high-tech MEMS sensor products.

Read more…

29 {{ "2024-03-29T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-29T00:00:00+00:00" | date "longDate" }}

Samsung News

SAMSUNG DEMONSTRATES NEW CXL CAPABILITIES, INTRODUCES NEW MEMORY MODULE

Samsung unveiled the expansion of its CXL memory module portfolio and showcased its latest HBM3E technology, reinforcing leadership in high-performance and high-capacity solutions for AI applications.

Read more…

29 {{ "2024-03-29T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-29T00:00:00+00:00" | date "longDate" }}

Intel News

INTEL GAUDI 2 REMAINS ONLY BENCHMARKED ALTERNATIVE TO NV H100 FOR GENAI PERFORMANCE

The newest MLPerf results for Intel Gaudi 2 accelerator and 5th Gen Intel Xeon demonstrate how Intel is raising the bar for generative AI performance.

Read more…

28 {{ "2024-03-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-28T00:00:00+00:00" | date "longDate" }}

Rohde & Schwarz

Rohde & Schwarz first to show measurements on novel Bluetooth^® Channel Sounding signals for positioning accuracy

Rohde & Schwarz will present the first real-time measurements on the planned new Bluetooth^® signals to support Channel Sounding.

Read more…

28 {{ "2024-03-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-28T00:00:00+00:00" | date "longDate" }}

Sivers Semiconductors News

Sivers Semiconductors announces advanced laser product demonstrations at OFC 2024 in San Diego

Sivers Semiconductors announces that its subsidiary, Sivers Photonics, in collaboration with ecosystem partners,is demonstrating its advanced laser chip and array technology at the Optical Fiber Communication (OFC) Conference in San Diego on March 24-28, 2024.

Read more…

Technical Articles

75 GB/s Data Acquisition to Disk

Arrow Electronics and Infineon Technologies introduce 240W USB PD3.1 Reference Design

New reference design supports up to 48V@5A Power Delivery Object sink mode, which is the highest level achievable with the latest USB Power Delivery standards.

Antaira Ethernet Extension Kit Supports Long-Reach Transmission of Data and PoE

Antaira Technologies launched a turnkey solution kit that extends the reach of 10/100 Ethernet and 802.3at PoE over UTP copper cabling up to 800 meters for reliable point-to-point connectivity.

Infineon introduces 80 V MOSFET OptiMOS™ 7 with lowest on-resistance in the industry for automotive applications

Infineon Technologies AG has introduced the first product in its new advanced power MOSFET technology OptiMOS™ 7 80 V:.

Mouser Signs Global Distribution Agreement with Vox Power to Deliver Innovative Power Solutions

Mouser Electronics the authorised global distributor with the newest electronic components and industrial automation products, today announces a new global distribution agreement with Vox Power, a leading manufacturer of AC/DC power supplies and DC/DC converters.

TDK offers DC link capacitors for +105 °C

TDK Corporation presents a new series of EPCOS power capacitors for DC link applications designed for an operating temperature of up to +105 °C.

STMICROELECTRONICS PRESENTS ALL-IN-ONE MEMS STUDIO DESKTOP SOFTWARE SOLUTION

Easy to use, efficient, and consolidated tool supports application development for next-gen high-tech MEMS sensor products.

SAMSUNG DEMONSTRATES NEW CXL CAPABILITIES, INTRODUCES NEW MEMORY MODULE

Samsung unveiled the expansion of its CXL memory module portfolio and showcased its latest HBM3E technology, reinforcing leadership in high-performance and high-capacity solutions for AI applications.

INTEL GAUDI 2 REMAINS ONLY BENCHMARKED ALTERNATIVE TO NV H100 FOR GENAI PERFORMANCE

The newest MLPerf results for Intel Gaudi 2 accelerator and 5th Gen Intel Xeon demonstrate how Intel is raising the bar for generative AI performance.

Rohde & Schwarz first to show measurements on novel Bluetooth^® Channel Sounding signals for positioning accuracy

Rohde & Schwarz will present the first real-time measurements on the planned new Bluetooth^® signals to support Channel Sounding.

Sivers Semiconductors announces advanced laser product demonstrations at OFC 2024 in San Diego

Sivers Semiconductors announces that its subsidiary, Sivers Photonics, in collaboration with ecosystem partners,is demonstrating its advanced laser chip and array technology at the Optical Fiber Communication (OFC) Conference in San Diego on March 24-28, 2024.

International

Technical Articles

New reference design supports up to 48V@5A Power Delivery Object sink mode, which is the highest level achievable with the latest USB Power Delivery standards.

Antaira Technologies launched a turnkey solution kit that extends the reach of 10/100 Ethernet and 802.3at PoE over UTP copper cabling up to 800 meters for reliable point-to-point connectivity.

Infineon Technologies AG has introduced the first product in its new advanced power MOSFET technology OptiMOS™ 7 80 V:.

Mouser Electronics the authorised global distributor with the newest electronic components and industrial automation products, today announces a new global distribution agreement with Vox Power, a leading manufacturer of AC/DC power supplies and DC/DC converters.

TDK Corporation presents a new series of EPCOS power capacitors for DC link applications designed for an operating temperature of up to +105 °C.

Easy to use, efficient, and consolidated tool supports application development for next-gen high-tech MEMS sensor products.

Samsung unveiled the expansion of its CXL memory module portfolio and showcased its latest HBM3E technology, reinforcing leadership in high-performance and high-capacity solutions for AI applications.

The newest MLPerf results for Intel Gaudi 2 accelerator and 5th Gen Intel Xeon demonstrate how Intel is raising the bar for generative AI performance.

Rohde & Schwarz will present the first real-time measurements on the planned new Bluetooth® signals to support Channel Sounding.

Sivers Semiconductors announces that its subsidiary, Sivers Photonics, in collaboration with ecosystem partners,is demonstrating its advanced laser chip and array technology at the Optical Fiber Communication (OFC) Conference in San Diego on March 24-28, 2024.

International

Rohde & Schwarz will present the first real-time measurements on the planned new Bluetooth^® signals to support Channel Sounding.