Diodes Incorporated introduces SDT2U30CP3, SDT2U40CP3, and SDT2U60CP3 with industry-leading current densities, low forward voltage drop, and thermal resistance for smaller, more efficient portable, mobile, and wearable devices.
For the fourth time in a row, the trade magazine Chip and Globis rank the Munich-based semiconductor company one of the most innovative companies in Germany.
New STM32H7R/S microcontrollers raise embedded-application performance to new levels for next-generation smart devices in factories, buildings, infrastructure, and eHealth.
TI's exhibit in hall 3A, booth 131 will showcase the latest advancements in application areas such as robotics, energy transition and electric vehicles.
Vishay Intertechnology has announced that it has upgraded its TFBS4xx and TFDU4xx series of infrared (IR) transceiver modules for IrDA® applications to offer 20 % longer link distance and improved ESD robustness to 2 kV.
The informative virtual Rohde & Schwarz event will span two half days, offering design engineers the opportunity to attend application-oriented presentations delivered by oscilloscope experts. Eight online workshop sessions will provide insights into different day-to-day testing challenges that electronic design engineers face when using oscilloscopes.