Green Hills Software, the worldwide leader in embedded safety and security, has announced new capabilities that increase the productivity of software developers creating safety-sensitive automotive software when they use the MULTI® integrated development environment (IDE) and Green Hills Probe for the Infineon TRAVEO II processor.
Anritsu Corporation is pleased to announce the simultaneous launch of its TRX Test Module MU887002A, designed to improve the efficiency of production-line inspection of wireless communications devices, including 5G, and its space-saving Universal Wireless Test Set MT8872A.
Streamlines Continuous Integration workflows from development to building and testing of applications with demands for Functional Safety certification.
TDK Corporation (TSE:6762) presents the fully revised version 4.0 of the tried and tested Online AlCap Useful Life Calculation Tool for EPCOS aluminum electrolytic capacitors.
ROHM has developed a new Wi-SUN FAN (Field Area Network) module for infrastructure applications, capable of connecting up to 1,000 nodes in a mesh network.
TDK Corporation (TSE 6762) has expanded its Micronas embedded motor controller portfolio to address higher temperature applications. The HVC 4222F and HVC 4422F were developed for operating smart actuators in applications with ambient temperature requirements up to 150 °C. HVC 4222F offers 32k flash memory while the HVC 4422F comes with 64k flash for more complex software implementations. These high temperature devices target applications in combustion vehicle drive trains, and emerging thermal management systems in electric and hybrid vehicles.*
Chromatic white-light sensor increases options for rapid non-contact scanning, helps electronics and medical manufacturers succeed with emerging technologies.