02
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Powell Electronics News
30
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Rutronik News
Hybrid Mobile Processors with Integrated AI Acceleration
Rutronik expands its processor portfolio with Intel Core Ultra Series 3, targeting AI PCs, mobile systems, and certified embedded edge applications.
30
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Tria Technologies News
Compact OSM module targets edge AI platforms
Tria Technologies introduces a 45 mm system-on-module built around NXP’s i.MX 95 for industrial and vision-based edge computing.
30
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Keysight technologies News
Multi-Terabit Interconnect Validation for AI Data Centers
Keysight Technologies and Point2 Technology collaborate to validate power-efficient interconnects for hyperscale AI infrastructure.
29
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Phytec News
Compact SoM Targets Real-Time Industrial Edge Designs
PHYTEC introduces a 30 mm module based on NXP’s i.MX RT1170 MCU with Zephyr OS support for secure, low-power embedded and IoT applications.
29
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Powell Electronics News
AcceleRate mP 0.635 mm Pitch Connectors Now Available from Powell
High-density Samtec interconnects support 64 Gbps PAM4 for AI, HPC, and advanced datacom.
29
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Microchip News
PolarFire FPGA Video Ecosystem Enhances High-Bandwidth Embedded Vision Designs
Expansion of PolarFire FPGA smart embedded video ecosystem by Microchip Technology supports low-power, high-resolution video connectivity for medical, industrial and robotic vision systems.
29
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NEC Corporation News
High-Efficiency Sub-6GHz Power Amplifier Module
NEC Corporation develops a compact PAM to reduce power consumption and size in 5G radio units.
28
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MIkroe News
Remote MCU Development Toolchain Integration
MIKROE and Renesas collaborate to provide early-stage MCU development access through a remote hardware infrastructure and integrated embedded development tools.
28
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TDK News
