04 {{ "2026-02-04T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-02-04T00:00:00+00:00" | date "longDate" }} Broadcom News Unified Wi-Fi 8 Architecture for Enterprise Networks Broadcom has introduced a Wi-Fi 8 access point and switch platform designed for AI-ready enterprise networks. Read more…
02 {{ "2026-02-02T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-02-02T00:00:00+00:00" | date "longDate" }} MURATA News Integrated Inertial Sensing for Industrial Mobility Systems Murata Manufacturing and Angst+Pfister collaborate to integrate high-accuracy inertial sensors into industrial mobility and positioning solutions. Read more…
02 {{ "2026-02-02T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-02-02T00:00:00+00:00" | date "longDate" }} Powell Electronics News Powell Adds Modular Connectors for Harsh Environments Configurable circular interconnects support compact system design in transport, energy, and industrial automation. Read more…
30 {{ "2026-01-30T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-01-30T00:00:00+00:00" | date "longDate" }} Rutronik News Hybrid Mobile Processors with Integrated AI Acceleration Rutronik expands its processor portfolio with Intel Core Ultra Series 3, targeting AI PCs, mobile systems, and certified embedded edge applications. Read more…
30 {{ "2026-01-30T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-01-30T00:00:00+00:00" | date "longDate" }} Tria Technologies News Compact OSM module targets edge AI platforms Tria Technologies introduces a 45 mm system-on-module built around NXP’s i.MX 95 for industrial and vision-based edge computing. Read more…
30 {{ "2026-01-30T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-01-30T00:00:00+00:00" | date "longDate" }} Keysight technologies News Multi-Terabit Interconnect Validation for AI Data Centers Keysight Technologies and Point2 Technology collaborate to validate power-efficient interconnects for hyperscale AI infrastructure. Read more…
29 {{ "2026-01-29T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-01-29T00:00:00+00:00" | date "longDate" }} Phytec News Compact SoM Targets Real-Time Industrial Edge Designs PHYTEC introduces a 30 mm module based on NXP’s i.MX RT1170 MCU with Zephyr OS support for secure, low-power embedded and IoT applications. Read more…
29 {{ "2026-01-29T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-01-29T00:00:00+00:00" | date "longDate" }} Powell Electronics News AcceleRate mP 0.635 mm Pitch Connectors Now Available from Powell High-density Samtec interconnects support 64 Gbps PAM4 for AI, HPC, and advanced datacom. Read more…
29 {{ "2026-01-29T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-01-29T00:00:00+00:00" | date "longDate" }} Microchip News PolarFire FPGA Video Ecosystem Enhances High-Bandwidth Embedded Vision Designs Expansion of PolarFire FPGA smart embedded video ecosystem by Microchip Technology supports low-power, high-resolution video connectivity for medical, industrial and robotic vision systems. Read more…
29 {{ "2026-01-29T00:00:00+00:00" | date "MMM" }} '26 Written on {{ "2026-01-29T00:00:00+00:00" | date "longDate" }} NEC Corporation News High-Efficiency Sub-6GHz Power Amplifier Module NEC Corporation develops a compact PAM to reduce power consumption and size in 5G radio units. Read more…